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Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing solderability testing of components. This technical paper encompasses critically important information about the solderability testing process and is entitled “The Role of Solderability Testing and Its Importance in Successful Soldering.”
Topics covered within this publication include solderability test methods, testing protocols, acceptance criterion, and testing procedures. The dip-and-look qualitative test method and the wetting balance quantitative test method are described in detail as well as the reasons behind the need to perform solderability testing to ensure frobust and reliable solder joints.
