Global Citizenship: Cultivating Cross-border Partnerships With Integrity
Nolan’s Notes: Moving Forward With Confidence
The Knowledge Base: Beyond the Badge—Why Membership Matters More Than Ever
Gen3’s Dr. Chris Hunt to Present at SMTA Electronics in Harsh Environments Conference
May 5, 2022 | Gen3Estimated reading time: 1 minute
Gen3, a British manufacturer of testing and measuring the electronics industry, announced that Dr Chris Hunt, CTO, will present during the SMTA Electronics in Harsh Environments Conference. The presentation, “Objective Evidence and How to Convince the Auditors,” will take place on Wednesday, May 18, 2022, from 16:30 – 17:00 p.m. at the Park Plaza Victoria Amsterdam.
Gen3’s Dr. Chris Hunt will be addressing the question that everyone is facing in the industry globally, what does ”Objective Evidence “mean/require?
- This will be a measurement system that will be repeatable and reproducible, and that can have a metric that directly relates to performance.
- For ECM a suitable metric is resistance.
- ECM produces corrosion products and ionic current flows that contribute to unwanted circuit elements.
- A measurement of the isolation resistance between circuit features therefore provides a direct circuit performance metric.
- SIR and CAF are examples of techniques that measure resistance, and hence provide Objective Evidence .
SIR, for process validation testing, was first established more than 30 years ago. It was a spin-off from the British CFC Elimination Project led by Dr Colin Lea OBE, at the British National Physical Laboratory. With the then advent of no-clean fluxes, it was the only test method to determine electro-chemical reliability and hence acceptable cleanliness as used at that time.
It was recognised as unsuitable for process control and that process ionic contamination testing (PICT) should be maintained for fast and effective control within 15 minutes.
New test methods have been introduced by IEC in the past 2 years:
- IEC 61189-5-502 – Surface Insulation Resistance (SIR) testing of assemblies - 2021
- IEC 61189-5-504 – Process Ionic Contamination Testing (PICT) - 2020
Gen3’s presentation will also look at the other test methods and compare their pro’s and con’s, including Ion Chromatography, FTIR, SEM + EDAX and new Digital Microscopy.
- The Printed Circuit Assembler’s Guide to… Process Validation by Graham K. Naisbitt
- “Predicting Reliability in Electronics,” a free 12-part webinar series with experts Graham Naisbitt and Chris Hunt
- Roundtable Discussion: Process Ionic Contamination Test (PCT) Standard Roundtable with Industry Experts, including Graham Naisbitt of GEN3, Teresa Rowe of IPC, Jason Keeping of Celestica, and Doug Pauls of Collins Aerospace
- You can also view other titles in our full I-007e book library here.
Share on:
Suggested Items
TTCI Celebrates Melanie Rutkauskas’ 10-Year Anniversary and Her Leadership of New Training Division
06/12/2025 | TTCIThe Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is proud to celebrate Melanie Rutkauskas on her 10-year anniversary with the company.
Bridging the Knowledge Gap in Test: A Conversation with Bert Horner
06/11/2025 | Barry Matties, I-Connect007Bert Horner is a seasoned industry veteran and co-creator of The Test Connection, Inc. (TTCI), a test and inspection company spanning over 45 years. In this candid conversation, Bert reflects on the challenges our industry faces with the retirement of career professionals and the subsequent loss of critical tribal knowledge. As he unveils The Training Connection’s innovative training initiatives, Bert emphasizes the importance of evolving educational programs that align with industry needs, particularly in design for test (DFT), and sheds light on strategies being implemented to foster the next generation of engineers.
IPC Hall of Fame Spotlight Series: Highlighting Bob Neves
06/11/2025 | Dan Feinberg, I-Connect007Many IPC members who have contributed significantly to IPC and our industry have been awarded the IPC Raymond E. Pritchard Hall of Fame (HOF) Award. This Hall of Fame spotlight features industry veteran Bob Neves, who joined IPC in 1986 and was inducted into the IPC Hall of Fame in 2007.
GEN3 Set to Host HATS²™ Technical Day at A.W. Technical Centre with Bob Neves
06/09/2025 | Gen3GEN3, a global leader in reliability testing and measurement solutions for the electronics industry, is excited to announce a dedicated HATS²™ Technical Day to be held at the A.W. Technical Centre in Farnborough, GEN3’s HQ. The event will showcase the HATS²™ (Highly Accelerated Thermal Shock) system with demos and presentations by Bob Neves, Chairman of RAS Inc. and creator of the HATS²™.
Target Condition: From Dream House to Drill Files
06/05/2025 | Kelly Dack -- Column: Target ConditionIf you caught the movie “Barbie,” you may have laughed at its over-the-top utopia where every day begins with perfect weather, perfect smiles, and a perfectly pink commute. But beyond the plastic glam, the film subtly critiques the illusion of perfection—a message that feels surprisingly relevant to the world of PCB design and manufacturing.