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Meet with KIC's Thermal Process Experts Who Make Ovens Smarter at SMTA Juarez & SMTA Tijuana
May 5, 2022 | KICEstimated reading time: 1 minute

KIC is pleased to announce plans to exhibit at the SMTA Juarez and Tijuana Expo & Tech Forums in Mexico. The SMTA Juarez Expo & Tech Forum is scheduled to take place Thursday, May 19, 2022 at the CIITA – IPN Chihuahua. The SMTA Tijuana Tech Day & Expo will be held Thursday, May 26, 2022 at the Quartz Hotel. Miguel Carbajal, KIC’s Mexico Sales Manager, will be available to discuss Reflow Process Inspection (RPI), Wave Process Inspection (WPI), NPI setup, process and recipe optimization for reduced defects, improved OEE, oven performance tracking and solutions for thermal processes.
The company offers the industry’s leading solution for turning Heat to Data™, offering a complete ecosystem that covers all electronics assembly and semiconductor packaging thermal processes, as well as manufacturing challenges for process setup and inspection. KIC offers automation, traceability and connectivity for the automotive, medical, aerospace, network and military markets for electronic manufacturing.
Electronics manufacturing today requires automated and real-time process control and traceability. Like SPI and AOI are for optical inspection, inspection of the production reflow temperature profile is a must. Process control, traceability and quality solder joints can be delivered with real-time inspection capabilities. That is what KIC provides (and invented) for your thermal processes. This critical data should be a part of your overall Industry 4.0 smart factory solution to ensure all production through the oven is within specifications and that profile data is readily available for each individual board.
KIC has solutions for challenges such as handling process audits, automating manual profiling and data reporting tasks, MES connectivity, Industry 4.0 implementation, NPI process setup, reducing solder defects (voiding, head in pillow, tombstoning), and more.
The latest addition to the thermal process inspection family is KIC’s WPI, bringing its award-winning technology and thermal experience to the wave solder process. Wave Process Inspection provides users with automatic profiling – including an industry first dwell time and parallelism measurement for each production board – real-time preheat and wave analytics, automatic SPC charting and more.
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Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
Breaking Silos with Intelligence: Connectivity of Component-level Data Across the SMT Line
06/09/2025 | Dr. Eyal Weiss, CybordAs the complexity and demands of electronics manufacturing continue to rise, the smart factory is no longer a distant vision; it has become a necessity. While machine connectivity and line-level data integration have gained traction in recent years, one of the most overlooked opportunities lies in the component itself. Specifically, in the data captured just milliseconds before a component is placed onto the PCB, which often goes unexamined and is permanently lost once reflow begins.
BEST Inc. Introduces StikNPeel Rework Stencil for Fast, Simple and Reliable Solder Paste Printing
06/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and products is pleased to introduce StikNPeel™ rework stencils. This innovative product is designed for printing solder paste for placement of gull wing devices such as quad flat packs (QFPs) or bottom terminated components.
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.