Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
ViTrox Hosts User Group Meeting 2022 in Mexico
May 10, 2022 | ViTrox TechnologiesEstimated reading time: 1 minute
ViTrox Technologies, is delighted to announce the User Group Meeting (UGM) 2022 in Mexico will be taken place on 12 May 2022 from 1:30 p.m. - 7:00 p.m. (CST) at Salón Vallarta, Riu Plaza Guadalajara, Mexico.
The purpose of UGM is to uplift our customer's knowledge and experience with the latest product sharings. During UGM, our experts will be partnering with SMTo Engineering, ViTrox’s Sales Channel Partner (SCP), to cover a variety of ViTrox’s One-Stop Smart Inspection Solutions sharing sessions consisting of Advanced 3D Solder Paste Inspection (API) System, Advanced 3D Optical Inspection (AOI) System, Advanced 3D X-Ray Inspection (AXI) System, Advanced Robotic Vision (ARV) System and Industry 4.0 Smart Solution V-ONE®.
Apart from the innovative product features and SMT inspection capabilities, our sharing session will cover you with the revolutionary closed-loop capabilities of what our V-ONE® is able to achieve by providing your production with its latest new feature. One of the key features - ONE View feature provides users and engineers with the real-time production process insights through image traceability across ViTrox Machines (API, AOI and AXI) which enable them to perform process analysis of defective components by cross-referencing test results side-by-side. Overall, ViTrox One-Stop Smart Inspection Solutions coupled with V-ONE® is now more powerful than ever as it is the ideal solution that simplifies the verification process and eliminates the false call rate during manual buyoff.
Through the sharing sessions, attendees will have a better understanding and witness optimal production efficiency and high production yield throughput provided by ViTrox’s Smart Factory Solutions. Besides that, our technical and sales experts will be present at the event to provide the best quality service and support for attendees to connect and exchange thrilling user experiences. Furthermore, our new demo room is coming soon in the Tijuana region. So, stay tuned for our new demo room, which the soft opening will be launching in June 2022.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.