-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
A Game Plan for Upskilling Your Fab Workforce
May 10, 2022 | I-Connect007 Editorial TeamEstimated reading time: 2 minutes

There’s been a lot of talk among PCB manufacturers about the need to upskill their workforce. But where do you start—do you set up your own program or send staff to third-party training centers?
The I-Connect007 Editorial Team recently asked David Hernandez, IPC vice president of education, to weigh in on this topic, and the criteria that goes into creating IPC training programs. In addition to upskilling strategies, David also delves into the need for our industry to develop a labor pipeline, as well as the challenges we face in hiring, training, and retaining employees in this industry during a tight labor market.
Nolan Johnson: Dave, our conversation today is on upskilling and how the circuit board fabricators should be looking at that situation. This is a big issue for the industry as we deal with staffing issues.
David Hernandez: We are seeing challenges for companies trying to hire at the operator level, the unskilled or low-skill level, but also seeing the same challenges at the high-skill levels, like engineering, as well. Now, there are different challenges in each one, but the consistent theme across the board is that we don’t have a pipeline that is feeding talent directly into the industry, and therefore industry is struggling to identify ways to bring in talent. Once they bring in the talent, they’re having challenges to onboard and level-set that talent, because they’re not pre-trained. They are also having challenges just keeping talent in the industry.
Finally, and it’s a big part of what this conversation is about: Once they have that talent in the industry and they’re able to keep them, how are they able to continually upskill them to new technologies, new processes, and best practices? When we talk about these challenges, it’s not one thing; it’s really a culmination of these different challenges throughout the industry coming together at the same time.
Johnson: Interesting. I was about to ask you whether one tackles this by hiring people with proven skills or by hiring people who seem to have an aptitude and then training them. I think I know the answer.
Hernandez: You should hire whoever you can hire at this point. You take whatever you can get. It’s kind of funny (but not really), but I have companies that have told me they will hire people out of supermarkets. They will take anyone that they can get at this point because the challenges are so great that they would rather have a body who is untrained than not have anyone.
Johnson: Well, that certainly does put a spotlight on basic training and upskilling.
Hernandez: Yes. It’s a perfect storm today.
To read the entire interview, which appeared in the April 2022 issue of PCB007 Magazine, click here.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
New Course Presents a Comprehensive Guide to IPC Standards
10/13/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
Is Glass Finally Coming of Age?
10/13/2025 | Nolan Johnson, I-Connect007Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.
The Training Connection, LLC Welcomes Industry Veteran Jack Harris to Lead Training Partnerships
10/07/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce that Jack Harris, one of the most recognized names in electronics manufacturing training and technical development, has joined the company as Relationship Lead, Training.
EDADOC Ushers in a New Era of Robotics Innovation
10/07/2025 | Edy Yu, Editor-in-Chief, ECIOOn Sept. 11, Shanghai Zhiyuan Technology Co., Ltd. (MScape) made a stunning debut at Shanghai’s 2025 Fourth North Bund Cybersecurity Forum and Cyber Intelligence Security Frontier Technology and Equipment Exhibition. The company presented the world’s first Dvorak super heterogeneous architecture and the Zhijing T-series-embodied intelligence (robotics) edge computing power platform. This has been a game-changer in the cybersecurity technology field, filling the gap in the domestic robotics core computing power platform.