Nolan’s Notes: Everyone Has Their Eye on India
Standard of Excellence: The Human Touch in an Automated World
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
IPC, ITI to Host Virtual Conference on Critical and Emerging Environmental Product Requirements
May 10, 2022 | IPCEstimated reading time: 1 minute
IPC and the Information Technology Industry Council (ITI) will host a virtual conference, “Critical and Emerging Environmental Product Requirements” on June 7 from 11:00 a.m. to 3:30 p.m. EDT. The event will explore the latest environmental requirements that impact product design, manufacturing, supply chain management, and technology innovation.
Speakers include leading environmental regulatory experts Liz Moorman from the U.K. Department for Environment, Food and Rural Affairs (DEFRA); Peter Alcock from the U.K. Department for Business, Energy & Industrial Strategy (BEIS); Ana Corado and Tala Henry from the ?U.S. Environmental Protection Agency (EPA); and Kevin Wolfe from Intel.
Alcock and Moorman will cover U.K. Restriction of Hazardous Substances (RoHS) regulations. Corado will present on Toxic Substances Control Act (TSCA) risk evaluations and risk management. Henry will cover EPA’s actions to address to per- and polyfluoroalkyl substances (PFAS) and Wolfe will discuss industry collaboration on PFAS.
“Existing chemical and product requirements are evolving and, in addition, we see newly emerging requirements. Combined, these make it difficult to stay ahead of what is needed in terms of compliance,” said Kelly Scanlon, IPC director of environmental policy and research. “Misunderstanding these ever-changing requirements could have a disastrous impact for business. ITI and IPC’s virtual conference will provide the information compliance professionals and officers need to be up to date with legal, regulatory, and customer requirements.”
“Environmental compliance regulations across the globe continue to evolve,” said Chris Cleet, ITI vice president of policy, environment and sustainability. “This conference will give companies a unique opportunity to hear directly from government officials and experts about the current policy landscape and provide critical information and resources compliance professionals need to effectively navigate new regulations and stay ahead of future changes.”
The event is sponsored by The Compliance Map, Orbis Compliance, GreenSoft Technology, Inc., Source Intelligence, and S&P Global Engineering Solutions.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
LPKF Strengthens LIDE Technology Leadership with New Patent Protection in Korea
09/04/2025 | LPKFLPKF Laser & Electronics SE today announced that its groundbreaking LIDE (Laser Induced Deep Etching) technology has received additional patent protection in Korea through the Korean Patent Office (KPCA), effective September 1, 2025.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
CEE PCB Launches PCBpedia: A New Knowledge Hub for Circuit Board Technology
09/03/2025 | CEE PCBCEE PCB, a leading manufacturer of PCBs and FPCs, is responding to the growing demand for reliable technical knowledge. With PCBpedia, CEE introduces a new knowledge platform featuring expert articles on key topics in circuit board technology – from FPC design rules to surface finishes.
Coming Soon: The Advanced Electronics Packaging Digest
08/27/2025 | Marcy LaRont, I-Connect007The upcoming Advanced Electronics Packaging Digest is a curated, condensed monthly publication designed to keep you informed and engaged with the fast-moving world of advanced electronics packaging (AEP). In our inaugural September issue, we will begin at the foundation with an in-depth interview featuring Matt Kelly, CTO of the Global Electronics Association. Kelly and his Technology Solutions Team approach advanced packaging from a holistic systems perspective.
Nordson Reports Q3 Fiscal 2025 Results and Updates Full Year Guidance
08/21/2025 | BUSINESS WIRENordson Corporation reported results for the fiscal third quarter ended July 31, 2025. Sales were $742 million compared to the prior year’s third quarter sales of $662 million.