Designers Notebook: Addressing Future Challenges for Designers
Connect the Dots: Designing for Reality—Surface Finish
Fresh PCB Concepts: Tariffs and the Importance of a Diverse Supply Chain
Altus Respond to Koh Young’s Successful New Semicon Focused Inspection System
May 18, 2022 | Altus GroupEstimated reading time: 1 minute
Returning from supporting their pre-eminent suppliers at SMTconnect in Germany, Altus Group, a leading distributor of capital equipment in the UK and Ireland, has reported an increased interest in many products including Koh Young’s new Meister S High-Resolution Inspection system.
Launched at the SMTconnect, which welcomed industry leaders from the global electronics community, Meister Model S was central on Koh Young’s stand and drew much attention from visitors at the show.
Building on the popular range of inspection platforms in both AOI and SPI processes, the Meister is the industry’s leading inspection system for advanced packaging and semiconductors. The new Meister S model includes a 3.5 µm pixel resolution and a 25 MP high-speed camera.
Anthony Oh, Technical Applications Manager, Altus said: “The reaction to the new Meister S at SMTconnect, and since returning from the show, has been extremely positive. The new S Model was developed to meet the demand for Wafer-Level-Packaging applications.
“Koh Young reported that the average bump size of 70 µm will decrease to 50 µm in the near future. To meet the impending demand, Meister S was developed with a new camera optimized for high-speed image acquisition in a 24/7 production environment. The system also includes an updated lens system. It is an impressive addition to the AOI line-up and we predict it will be a popular choice for our customers this year.
“Any addition to Koh Young’s equipment portfolio is very welcome by the Altus team. As a world-class leader in 3D measurement-based inspection solutions, we know that their new system will be of the highest quality and a sound investment for our customers.”
Additional content from Koh Young:
- The Printed Circuit Assembler’s Guide to… SMT Inspection: Today, Tomorrow, and Beyond by Brent Fischthal
- “Converting Process Data Into Intelligence” by Joel Scutchfield and Ivan Aduna, a free 12-part micro webinar series
- You can also view other titles in our full I-007e book library here
Share on:
Suggested Items
Incap Slovakia Enhances SMT Quality with Automated Paste Inspection
02/07/2025 | IncapAt Incap Slovakia, quality and efficiency are at the core of our Surface Mount Technology (SMT) production. To further strengthen process control and minimise defects, we have implemented Automated Paste Inspection (API)—a high-precision system that ensures the accuracy and consistency of solder paste printing.
US Air Force Completes First Flight of L3Harris Viper Shield Electronic Warfare System
02/06/2025 | L3Harris TechnologiesThe L3Harris Technologies all-digital electronic warfare (EW) suite, Viper Shield™, has completed its first flight in a single-seat Block 70 F-16 operated by the 412th Test Wing at Edwards Air Force Base, California.
Delvitech to Officially Present Hybrid AOI + SPI Horus System at IPC APEX EXPO 2025
02/06/2025 | DelvitechDelvitech is happy to announce that it will showcase its groundbreaking Horus system, the industry's first all-in-one AI native platform for both Automatic Optical Inspection (AOI) and Solder Paste Inspection (SPI), at the upcoming IPC APEX EXPO 2025. The event is scheduled from March 18 to 20, 2025, at the Anaheim Convention Center in Anaheim, California.
Teledyne Completes Acquisition of Select Aerospace and Defense Electronics Businesses of Excelitas
02/05/2025 | BUSINESS WIRETeledyne Technologies Incorporated announced today the successful completion of the acquisition of select aerospace and defense electronics businesses from Excelitas Technologies Corp. (“Excelitas”) for approximately $710 million. The acquisition includes the optical systems business known under the Qioptiq® brand based in Northern Wales, UK, as well as the U.S.-based advanced electronic systems business.
AV Secures $288 Million Delivery Order on $990 Million Contract with U.S. Army
02/04/2025 | BUSINESS WIREAeroVironment (AV), a global leader in intelligent, multi-domain robotic systems, today announced it has been awarded its third delivery order totaling $288 million of Switchblade® loitering munition systems as part of U.S. Army’s Directed Requirement (DR) for Lethal Unmanned Systems (LUS).