Nolan’s Notes: Moving Forward With Confidence
The Knowledge Base: Beyond the Badge—Why Membership Matters More Than Ever
Smart Automation: AI—Revolutionizing Inspection in Electronics Manufacturing
Altus Respond to Koh Young’s Successful New Semicon Focused Inspection System
May 18, 2022 | Altus GroupEstimated reading time: 1 minute
Returning from supporting their pre-eminent suppliers at SMTconnect in Germany, Altus Group, a leading distributor of capital equipment in the UK and Ireland, has reported an increased interest in many products including Koh Young’s new Meister S High-Resolution Inspection system.
Launched at the SMTconnect, which welcomed industry leaders from the global electronics community, Meister Model S was central on Koh Young’s stand and drew much attention from visitors at the show.
Building on the popular range of inspection platforms in both AOI and SPI processes, the Meister is the industry’s leading inspection system for advanced packaging and semiconductors. The new Meister S model includes a 3.5 µm pixel resolution and a 25 MP high-speed camera.
Anthony Oh, Technical Applications Manager, Altus said: “The reaction to the new Meister S at SMTconnect, and since returning from the show, has been extremely positive. The new S Model was developed to meet the demand for Wafer-Level-Packaging applications.
“Koh Young reported that the average bump size of 70 µm will decrease to 50 µm in the near future. To meet the impending demand, Meister S was developed with a new camera optimized for high-speed image acquisition in a 24/7 production environment. The system also includes an updated lens system. It is an impressive addition to the AOI line-up and we predict it will be a popular choice for our customers this year.
“Any addition to Koh Young’s equipment portfolio is very welcome by the Altus team. As a world-class leader in 3D measurement-based inspection solutions, we know that their new system will be of the highest quality and a sound investment for our customers.”
Additional content from Koh Young:
- The Printed Circuit Assembler’s Guide to… SMT Inspection: Today, Tomorrow, and Beyond by Brent Fischthal
- “Converting Process Data Into Intelligence” by Joel Scutchfield and Ivan Aduna, a free 12-part micro webinar series
- You can also view other titles in our full I-007e book library here
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