-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSoldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
SEHO's SmartSplit: Cycle Time Halved for Selective Soldering in Mixed Production
May 20, 2022 | SEHO Systems GmbHEstimated reading time: 1 minute
SEHO Systems GmbH, a worldwide leading manufacturer of complete solutions for soldering processes and automated production lines, is one of the most innovative companies in the industry. One of these innovations is SmartSplit, an intelligent software that cuts the cycle time in half for selective soldering in mixed production.
With the appropriate sensors in the soldering system, SmartSplit controls and coordinates the process flow for different assemblies in mixed production. With this newly developed software component, an efficient system for batch production becomes an innovative selective soldering system for high-mix-high-volume production, without conversion and with minimal costs.
SmartSplit automatically distributes the various process tasks such as flux application, the soldering process with up to six soldering units and brushing process to the process stations available in the individual system, and thus enables cycle times to be cut in half from a quantity of one to large-scale production. The total processing time for the individual assembly is automatically minimized by the software. At the same time, the process stations do not restrict each other, so that the entire work area can be used.
Another advantage of SmartSplit is the simple programming: Only the entire soldering task has to be programmed for an assembly and the software automatically distributes it to the existing process stations.
The new software component SmartSplit is of particular advantage for electronics manufacturers that process a large range of assemblies or produce a large number of product variants. Regardless of whether small or large quantities are produced, SmartSplit automatically ensures the most efficient use of the selective soldering system.
SmartSplit can be integrated into the selective soldering systems SEHO SelectLine-C and SEHO LeanSelect-plus. As a modular inline selective soldering system, the SelectLine-C scores above all with its exceptional flexibility, while the LeanSelect-plus is perfectly designed for modern island production.
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.