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Remtec Announces the Industry's Most Complete Suite of Plating Capabilities Including PCTF Technology for Advanced Electronic Packaging

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Remtec, a leader in advanced metallized ceramic substrates and electronic packaging solutions, is proud to announce the availability of what is believed to be the industry's most comprehensive portfolio of plating surface finish technologies for thick film ceramic circuits and advanced electronic assemblies.

Mission Space Selected by NASA to Advance Lunar Environmental Monitoring Technology

07/01/2026 | PRNewswire
Mission Space has been selected by NASA under the Announcement of Collaboration Opportunity (ACO) to advance LEEMR, a compact lunar dust and surface-charging monitoring instrument developed for future lunar surface operations, in collaboration with NASA's Goddard Space Flight Center in Greenbelt, Maryland.

BOOK EXCERPT: The Printed Circuit Designer’s Guide to... UV Curable Conformal Coatings

06/09/2026 | I-Connect007
Chapter 1: Options for Protecting Electronic Assemblies and a Deep Dive into UV Conformal Coatings. Electronics, depending on fit and function, have different protective options including conformal coatings, potting materials, encapsulants, protective enclosures, sealing and gaskets.

Trouble in Your Tank: The Role of Organic Solderability Preservatives in Advanced Packaging

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Technology trends shaping the electronics industry supply chain—AI, IoT, ADAS, and high-performance computing (HPC)—are driving finer circuit features and higher layer counts. Advanced packaging drives the selection of surface finishes depending on the application. Typical designs require excellent solder joint reliability and wire bondability. It is not uncommon for designers to specify the organic solderability preservatives (OSP) on the BGA side of the substrate and precious-metal-plated finishes on the top side, which facilitate wire bonding.

Lockheed Martin Delivers First Integrated Combat System Baseline for the U.S. Navy

06/01/2026 | Lockheed Martin
Lockheed Martin has successfully delivered the first Integrated Combat System (ICS)-enabled baseline to the U.S. Navy.
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