-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Saki Corporation Launches Next-generation 3D AOI System
May 24, 2022 | Saki CorporationEstimated reading time: 1 minute
Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, has developed the new 3Di series of high-speed, high-precision, next-generation in-line 3D automated optical inspection (3D AOI) systems for complex inspection of high-density printed circuit boards and boards with a combination of very small and tall components. The new 3Di series is equipped with a newly developed camera system that significantly reduces cycle and produces ultra-sharp high-resolution 3D images thanks to its ability to simultaneously and accurately inspect both extremely small parts, such as 008004s (0201 metric), and tall parts at the same time. This latest automated inspection solution from Saki contributes to enhanced quality assurance and increased productivity and is perfect for highest quality inspection of ever-evolving high-density PCB technology.
Saki will debut the first AOI machine in this new 3Di series at the 23rd JISSO PROTEC 2022 show (June 15-17, Tokyo Big Sight International Exhibition Center, Japan). The machine configuration will feature a camera resolution of 8 ?m, a height measurement range of 25 mm, and an imaging speed of 4,500 mm2/s. The Saki team is looking forward to welcoming show visitors to booth 4D-12 in East Hall 4-6.
Key features of the new 3Di series include:
1. A newly developed high-resolution camera system that enables:
- high-resolution inspection of high-density PCBs and ultra-small components.
- expanded height measurement range.
2. Sophisticated software and hardware configuration that optimizes image processing and achieves the industry’s fastest cycle time.
3. An innovative and unique inspection algorithm that enables clear 3D solder joint inspection.
4. Scalability with the option to easily modify configurations at any time as required by adding new camera heads, AI functions, and other future features.
Norihiro Koike, President and CEO of Saki Corporation, commented: “Saki's new 3Di series keeps pace with the rapidly evolving needs of the market and delivers highest inspection quality and accuracy along with the fast cycle times demanded by the next generation of PCB technology. We will continue to develop add-on solutions in the future that will provide a variety of additional optional functions, offer flexibility, and contribute to sustainable manufacturing concepts that that are shaping our customers' smart factories. In addition to our own booth at JISSO PROTEC 2022, our latest AOI solution will also be showcased by Panasonic Connect Corporation on Booth No. 5D-29. We look forward to seeing you at the exhibition."
Suggested Items
Indium Corporation to Showcase Precision Gold Solder Solutions at MEDevice Silicon Valley 2024
11/18/2024 | Indium CorporationIndium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 20-21 in Silicon Valley, California. AuLTRA® MediPro is a family of high-performance, precision gold solder solutions for critical medical applications.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
11/14/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Silicon Valley Expo & Tech Forum taking place on December 5 at the Fremont Marriott Silicon Valley in Fremont, California.
Data-driven Precision in PCBA Manufacturing
11/13/2024 | Julie Cliche-Dubois, CogiscanThe intricacies involved in electronics manufacturing require more than just expensive equipment and skilled technicians; they necessitate an accurate understanding of the entire production flow, informed and driven by access and visibility to reliable data.
Rehm Thermal Systems Mexico Wins the Mexico Technology Award 2024 in the Category Convection Soldering
11/13/2024 | Rehm Thermal SystemsRehm Thermal Systems Mexico has won the Mexico Technology Award in the category convection soldering with the patented mechatronic curtain for convection soldering systems.
SMTA: Capital Chapter & Connecticut Chapter Joint Technical Webinar
11/12/2024 | SMTAThe SMTA Capital Chapter is co-hosting a free webinar for SMTA members with the SMTA Connecticut Chapter on Tuesday, November 19 at 11:00 a.m. EST.