-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSpotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
What's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Saki Corporation Launches Next-generation 3D AOI System
May 24, 2022 | Saki CorporationEstimated reading time: 1 minute

Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, has developed the new 3Di series of high-speed, high-precision, next-generation in-line 3D automated optical inspection (3D AOI) systems for complex inspection of high-density printed circuit boards and boards with a combination of very small and tall components. The new 3Di series is equipped with a newly developed camera system that significantly reduces cycle and produces ultra-sharp high-resolution 3D images thanks to its ability to simultaneously and accurately inspect both extremely small parts, such as 008004s (0201 metric), and tall parts at the same time. This latest automated inspection solution from Saki contributes to enhanced quality assurance and increased productivity and is perfect for highest quality inspection of ever-evolving high-density PCB technology.
Saki will debut the first AOI machine in this new 3Di series at the 23rd JISSO PROTEC 2022 show (June 15-17, Tokyo Big Sight International Exhibition Center, Japan). The machine configuration will feature a camera resolution of 8 ?m, a height measurement range of 25 mm, and an imaging speed of 4,500 mm2/s. The Saki team is looking forward to welcoming show visitors to booth 4D-12 in East Hall 4-6.
Key features of the new 3Di series include:
1. A newly developed high-resolution camera system that enables:
- high-resolution inspection of high-density PCBs and ultra-small components.
- expanded height measurement range.
2. Sophisticated software and hardware configuration that optimizes image processing and achieves the industry’s fastest cycle time.
3. An innovative and unique inspection algorithm that enables clear 3D solder joint inspection.
4. Scalability with the option to easily modify configurations at any time as required by adding new camera heads, AI functions, and other future features.
Norihiro Koike, President and CEO of Saki Corporation, commented: “Saki's new 3Di series keeps pace with the rapidly evolving needs of the market and delivers highest inspection quality and accuracy along with the fast cycle times demanded by the next generation of PCB technology. We will continue to develop add-on solutions in the future that will provide a variety of additional optional functions, offer flexibility, and contribute to sustainable manufacturing concepts that that are shaping our customers' smart factories. In addition to our own booth at JISSO PROTEC 2022, our latest AOI solution will also be showcased by Panasonic Connect Corporation on Booth No. 5D-29. We look forward to seeing you at the exhibition."
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Absolute EMS: The Science of the Perfect Solder Joint
09/05/2025 | Absolute EMS, Inc.Absolute EMS, Inc., a six-time award-winning provider of fast turnaround, turnkey contract electronic manufacturing services (EMS), is drawing attention to the critical role of 3D Solder Paste Inspection (SPI) in ensuring the reliability of both FLEX and rigid printed circuit board assemblies (PCBAs).
Indium Corporation to Highlight High-Reliability Solder Solutions at SMTA Guadalajara Expo
09/04/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, will feature a range of innovative, high-reliability solder products for printed circuit board assembly (PCBA) at the SMTA Guadalajara Expo and Tech Forum, to be held September 17-18 in Guadalajara, Mexico.
Dr. Jennie Hwang to Present on ‘Solder Joint Reliability’ at SMTA International 2025
09/03/2025 | Dr. Jennie HwangDr. Jennie Hwang to address “Solder Joint Reliability” at the 2025 SMTA International Conference on Monday, October 20. Leveraging her decades of extensive real-world experiences and deep knowledge,
Indium to Highlight Energy-Efficient, High-Reliability Solder Solutions for EV and Electronics at Productronica India
09/03/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, electric vehicle (EV), thin-film, and thermal management markets, will feature a range of sustainable, high-reliability solder products at Productronica India, to be held September 17-19 in Bengaluru, India.
Altus Supports Datalink Electronics with Advanced Selective Soldering Solution to Boost Manufacturing Efficiency
09/02/2025 | Altus GroupDatalink Electronics has partnered with Altus Group to integrate a cutting-edge automated soldering solution, enhancing its production capabilities and reinforcing its strategic focus on quality, automation, and scalability.