Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
Marcy’s Musings: Can You Hear the Voices?
Facing the Future: Successfully Navigating the Uncertain Path Ahead
Atotech to Participate at the IEEE 72nd ECTC
May 24, 2022 | AtotechEstimated reading time: 1 minute
Atotech is looking forward to presenting at the IEEE 72nd Electronic Components and Technology Conference (ECTC). This international event organized by IEEE Electronics Packaging Society will take place in San Diego, California from Tuesday, May 31, to Friday, June 3, 2022.
We are excited to announce that Mr. Kuldip Johal, Global OEM Pathfinding Director will be part of the 2022 ECTC Special Session on “How will IC substrate technology evolve to enable next-generation heterogeneous integration schemes for high- performance applications?” on Tuesday, May 31 from 3:30 p.m. to 5:00 p.m. (PDT).
Additionally, our experts Dr. Britta Schafsteller, Global Product Manager Selective Finishing, and Dr. Tobias Bernhard, Senior Scientist Electronics R&D Desmear and Metallization, will present and share their expertise.
Date: Wednesday, June 1
Time: 2:20 – 2:45 p.m. (PDT)
“Impact of the final finish on the solder joint reliability and IMC
formation after thermal storage”
by Dr. Britta Schafsteller
Date: Friday, June 3
Time: 3:30 – 3:55 p.m. (PDT)
“Plating and recrystallization of galvanic Cu films on roll annealed and polycrystalline Cu foils and the effect of intermediate electroless Cu layers”
by Dr. Tobias Bernhard
Conference:
Electronic Components and Technology Conference (ECTC)
Date: May 31, to June 3, 2022
Booth: #514
Venue: The Sheraton San Diego Hotel and Marina 1380 Harbor Island Drive San Diego, CA 92101
Share on:
Suggested Items
Indium to Feature Materials Solutions Powering Sustainability at PCIM Europe
04/15/2025 | Indium CorporationIndium Corporation specializes in power device packaging, offering a portfolio of advanced material solutions encompassing the entire assembly, including die-attach, top-side die interconnect, substrate-attach, package-attach, and PCB assembly.
BEST Inc to Host Soldering 101 Workshop at Illinois & Michigan Locations
04/15/2025 | BEST Inc.BEST Inc., a leader in electronic component services, training, and products is pleased to announce it will host multiple Soldering 101 workshops in its Rolling Meadows, Illinois and Lansing, Michigan locations.
Real Time with... IPC APEX EXPO 2025: Advancements in Inkjet Technology With Electra Polymers
04/14/2025 | Real Time with...IPC APEX EXPODon Monn from Electra Polymers discusses the evolution of inkjet technology since 2016, focusing on market changes and the reliability of inkjet products. He explains the additive inkjet process, which reduces waste and boosts efficiency. The conversation highlights Electra Polymers' strong market presence in North America and the importance of customer trust.
Saki’s AXI Upgrade Enhances Image Noise Reduction for Power Modules, Enabling Sharper, More Accurate Inspections
04/11/2025 | Saki CorporationSaki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, announces significant enhancements to the image processing capabilities of its 3Xi-M200 X-ray Automated Inspection (AXI) system.
Electra's ElectraJet EMJ110G Powers Seamless Transition at Sunrise Electronics
04/11/2025 | Electra Polymers LtdElectra, in partnership with Allen Woods Associates, is proud to announce the successful deployment of its ElectraJet® EMJ110G Soldermask on KLA’s Orbotech Neos™ platform, now running production at Sunrise Electronics in Elk Grove Village, Illinois.