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AIM Announces New AIM LUX Product Line
May 25, 2022 | AIMEstimated reading time: 1 minute
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the release of its new AIM LUXTM Product Line.
As a leading supplier to the miniLED industry, AIM designed its LUX solder materials to provide tier one manufacturers of LED, miniLED and hi-power LED assemblies with solder pastes and alloys to solve production challenges associated with these applications.
The LUX product line pairs ultra-fine SAC-based and silver-free Type 6, 7 and 8 alloy powders along with innovative flux chemistries. AIM’s NC259 series is proven to provide excellent soldering performance and high production yields. When combined with the SN100C® alloy, NC259 solder pastes eliminate silver migration concerns. AIM REL61TM is a low-silver alloy option that can lower peak reflow temperature requirements and improve mechanical strength over other low/no-silver alloys. For high-power LEDs, AIM's REL22TM doubles the service life under extreme thermal cycling conditions. AIM's Tacky Flux offers high tack forces, long open time, and improved wetting for all mass transfer and high-speed dipping applications.
“The Mini/MicroLED market is poised to experience exponential growth over the next 2-3 years,” said Timothy O’Neill, AIM’s Director of Product Management. “AIM LUX product line has been developed specifically to meet the needs of current and emerging technologies.”
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12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
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Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
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