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Indium Introduces New Ultra-Low Residue Flip-Chip Flux at ECTC
May 31, 2022 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation will introduce NC-809, a new halogen-free, ultra-low residue, flip-chip flux at the Electronic Components and Technology Conference (ECTC), May 31-June 3, San Diego, California, U.S. Engineered with high-tack characteristics, NC-809 is designed to hold die or solder spheres in place without risk of die shift during the assembly process.
NC-809 is designed to leave minimal residue after reflow, at the level of Indium Corporation’s proven ultra-low residue (ULR) fluxes such as NC-26S and NC-699. NC-809 exhibits superior wetting performance and is the first ULR flux qualified for ball grid array ball-attach applications for packages that are sensitive to traditional water cleaning processes. NC-809 also improves production yields by eliminating costly cleaning steps which can increase substrate warpage both after reflow and before the underfilling steps, creating the potential for die damage and cracked solder joints.
NC-809 offers:
- High tackiness to eliminate die tilting or shifting during reflow; greatly reducing electrical open failures
- Consistent flux deposition and excellent wetting
- Ultra-low residue; ideal for customers building tight-pitch flip-chip assemblies
- Compatibility with a wide variety of underfills
- Reduced warpage of package and lower thermal stress due to the absence of cleaning step
Download The Printed Circuit Assembler’s Guide to… Solder Defects by Christopher Nash and Dr. Ronald C. Lasky. You can also view other titles in our full I-007e book library here.
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