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Seika Announces Inventory Sale on Stock SAYAKA PCB Routers
June 1, 2022 | Seika Machinery, Inc.Estimated reading time: 1 minute
Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services is pleased to announce an inventory sale on stock SAYAKA PCB routers, including the SAM-CT23Q, SAM-CT23S, SAM-CT35Q, SAM-CT23NJ and SAM-CT56NJ. Additionally, the SAM-CT34XJ PCB Router is now available for demonstration at Seika’s Headquarters and Demonstration Center in Torrance.
The SAM-CT34XJ standalone works as an in-line and off-line router. It features a slide table for fast and easy loading/unloading of PCBs, repeatability ±0.01mm and low maintenance. The color CCD camera makes it easy to program, along with an automatic QR code reading and uploading program. The SAM-CT34XJ offers broken/slip bit detection and extended bit life with automatic bit position control.
There is no better way to depanel a printed circuit board than with the SAYAKA PCB Depaneling Router. This PCB depaneler is the answer for hassle-free PCB depaneling through the employment of a router bit that minimizes stress on components. The high-speed spindle included in the machine speeds up cutting and maintains precision, while also allowing for flexible panel designs with various cutting patterns.
Additionally, the SAM-CT34XJ PCB Router cuts down on bit replacement with its router bit depth adjustment system, which automatically shifts up to five depth levels. The PCB router bit maximum cutting speed is 50mm per second, while the traveling speed is a maximum of 800mm per second. With a built-in fixture-based dust vacuum system, the system is sure to be clean and efficient. This prevents warping, and takes full advantage of vacuum strength for the most effective dust collection.
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Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.