-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
AGC Multi Material General Division is Launching its New Website
June 3, 2022 | AGC Multi Material General DivisionEstimated reading time: Less than a minute
AGC Multi Material General Division is launching its new website www.agc-multimaterial.com.
The former Nelco and Taconic brands have been successfully integrated into the AGC brand. Product names remain the same, however everything else is now AGC.
AGC is looking forward to enhancing our cooperation with all our industry partners and customers. Customers can find information and downloads related to AGC's material solutions for high frequency and highspeed applications on the new website. AGC looks forward to strengthening cooperation with all industry partners and customers.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
08/29/2025 | Nolan Johnson, I-Connect007This week, we bring you Global Electronics Association’s Chris Mitchell’s government relations column on—you guessed it—trade deals. TTM is balancing its facilities between East and West. The Global Electronics Association released July numbers for North American PCB shipments, and the news is good. Meanwhile, the corresponding report for EMS might seem like bad news, but that’s misleading. Be sure to look deeper for the rest of the story. Finally, for a bit space-science palate cleansing, I’m sharing news of the latest launch of NASA’s X-37B.
Summit Interconnect Names Milan Shah as Vice Chairman of the Board
08/26/2025 | Summit Interconnect, Inc.Summit Interconnect, a leading provider of advanced PCB manufacturing, today announced that Milan Shah has been named Vice Chairman of the Board.
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
08/25/2025 | Chris Mitchell -- Column: The Government CircuitAs global trade winds continue to howl, the electronics manufacturing industry finds itself at a critical juncture. After months of warnings, the U.S. Government has implemented a broad array of tariff increases, with fresh duties hitting copper-based products, semiconductors, and imports from many nations. On the positive side, tentative trade agreements with Europe, China, Japan, and other nations are providing at least some clarity and counterbalance.
Lessons From a Thousand Columns: Dan Beaulieu on Writing, Selling, and Staying the Course
08/21/2025 | Michelle Te, I-Connect007For 20 years, Dan Beaulieu has been a steady voice in sales and marketing, offering weekly columns that challenge, inspire, and guide professionals in the electronics industry and beyond. Soon, he will reach a remarkable milestone—his 1,000th It’s Only Common Sense weekly column. In this Q&A, we look behind the scenes of Dan’s writing journey, exploring what has kept him motivated, the lessons he’s learned along the way, and how two decades of weekly columns have shaped his career and the industry conversation.
University Of Minnesota Team Claims Victory In Bright Manufacturing Challenge 2025 Round 1
08/19/2025 | EMACThe Electronics Manufacturing & Assembly Collaborative (EMAC) recently announced that Team "Rise and Grind Crew" from the University of Minnesota has emerged victorious in Round 1 of the Bright Manufacturing Challenge 2025.