Summer Sale on Select Seika's McDry Dry Cabinets
June 15, 2022 | Seika Machinery, Inc.Estimated reading time: Less than a minute
Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, today announced its summer sale on select McDry models. The company has brought in many popular models to meet demand and is offering a discount for a limited time.
McDry cabinets are the first desiccant based drying systems especially built for electronics assemblers and introduced in the U.S. more than 30 years ago. All cabinets are the latest models with upgraded dehumidification speed and recovery to set point two to three times faster. Additionally, the desiccant automatically recycles and does not require replacement.
All McDry cabinets maintain a 1% RH level and conform to the IPC-JEDEC J-STD 033D and IPC-1602 as well as the ESD standard, IEC-61340-5-1. Models in stock or coming by July include: DXU-1001A, DXU-1002A, DXU-1002LA, MCU-340A, MCU-201A, MC-1002A, MB-1001A and MB-301A. Supplies limited and sale subject to availability.
Suggested Items
Are Our Stackup Rules No Longer Valid?
12/19/2024 | Cherie Litson, EPTAC MIT CID/CID+Are the stackup rules we used to follow no longer valid? It depends on what you’re designing. Electrical rules change depending on your circuit. Fabrication rules change depending on which fabricator you’re working with. Today, we just have more options, and sometimes, cost is a bigger rule than anything else. If you search online for information about layer stackups, trace widths, and hole sizes in PCBs, you’ll find a variety of resources.
IPC/WHMA Launches Groundbreaking Online Course on Wire Harness Design
12/18/2024 | IPCIPC/WHMA is excited to announce the launch of its new online instructor-led training course, "Introduction to Wire Harness Design I," available now through the IPC EDGE Learning Management System.
IPC Releases Latest List of Standards and Revisions
12/17/2024 | IPC Community Editorial TeamEach quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q4 2024.
IPC, FED Partner for New Design Conference in Vienna
12/12/2024 | Andy Shaughnessy, Design007 MagazineIPC and its German partner FED have teamed up to create a new PCB design conference in Vienna, Austria. The Pan-European Electronics Design Conference (PEDC) is scheduled for Jan. 29-30 at the NH Danube City hotel in Vienna. IPC’s Peter Tranitz, one of the show organizers, discussed how this new show came about, pointing out that, unlike many of the regional conferences in Europe, PEDC will host curated, peer-reviewed presentations, not promotional content or product pitches. Will PEDC become an annual event?
Happy’s Tech Talk #35: Yields March to Design Rules
12/12/2024 | Happy Holden -- Column: Happy’s Tech TalkUltra high density interconnect (UHDI) has many forms, structures, and alternatives, so capturing all the variations and reducing them to design rules has required some departures from traditional IPC design standards. In this column, I’ll be discussing the IPC UHDI design guidelines and standards. The fundamental question is: “Do you need HDI or microvias?”