The Chemical Connection: Reducing Defects in Circuit Board Production
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June Issue of PCB007 Magazine Available Now
June 16, 2022 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Even though the plating process itself hasn’t changed much over time, there have been quite a few updates in the plating process, including process control, plating racks, and additives that enhance throwing power. Power supplies have come a long way in just the past decade or so, and newer tanks allow engineers to customize the amount of agitation and solution flow.
So, in the June issue of PCB007 Magazine, our contributors share a variety of strategies for PCB fabricators to to use in order to optimize their plating processes and carry them into the future.
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