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Suggested Items

The Hidden Enabler of Autonomous Warfare: Advanced PCB Technologies Behind Defense AI

06/16/2026 | Jesse Vaughan -- Column: Beyond the Board
Autonomous systems are rapidly reshaping the defense landscape. Unmanned aerial systems, autonomous maritime vessels, robotic ground vehicles, loitering munitions, and AI-enabled sensing platforms are now integral components of modern military operations. AI may serve as the brain of an autonomous system, but advanced PCBs form the foundation that allows those capabilities to operate reliably in the field.

Follow the Story: The Chemistry Behind PCB Fabrication

06/16/2026 | I-Connect007 Editorial Team
Many of the decisions that shape reliability, yield, sustainability, and cost happen long before a board reaches final inspection. The choice of metallization process, surface finish, water treatment strategy, or etching approach can significantly impact manufacturing outcomes. Here are four articles worth revisiting that tackle different aspects of the same conversation: the chemistry and processes behind modern PCB manufacturing.

From Dilution to ZLD: Optimizing Used Process Water Management

06/10/2026 | Richard Nichols, GreenSource Engineering
Last month, we began discussing the journey from dilution to zero liquid discharge. I highlighted that approximately 70% of the used process water (UPW) is generated from the dilute stream. This significant volume underscores the necessity for effective treatment processes that ensure the safe return of water into the production cycle while minimising environmental impact.

Cadence, Intel Foundry Collaborate to Optimize Intel 14A Process for HPC and Mobile

06/09/2026 | Cadence Design Systems
Cadence announced an expanded collaboration with Intel Foundry to advance Design Technology Co-Optimization (DTCO) targeting Intel’s next-generation process technologies, beginning with Intel 14A.

Trouble in Your Tank: The Role of Organic Solderability Preservatives in Advanced Packaging

06/08/2026 | Michael Carano -- Column: Trouble in Your Tank
Technology trends shaping the electronics industry supply chain—AI, IoT, ADAS, and high-performance computing (HPC)—are driving finer circuit features and higher layer counts. Advanced packaging drives the selection of surface finishes depending on the application. Typical designs require excellent solder joint reliability and wire bondability. It is not uncommon for designers to specify the organic solderability preservatives (OSP) on the BGA side of the substrate and precious-metal-plated finishes on the top side, which facilitate wire bonding.
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