-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueThe Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
Advanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
High Density Packaging User Group Announces Grace Electron Membership
June 30, 2022 | HDP User GroupEstimated reading time: Less than a minute
High Density Packaging (HDP) User Group is pleased to announce that Grace Electron Technology Co., LTD. has become a member.
“Grace Electron is a leading manufacturer of advanced halogen-free laminates suitable for high-frequency, high-speed applications,” said Dr. Winston Wong, CEO at Grace T.H.W. Group. “These laminates are used for telecommunications products that require low transmission losses and a low degree of distortion, such as wireless base stations, storage, and advanced cloud computing servers. We look forward to collaborating with HDP member companies on evaluating advanced materials for high frequency, high-speed applications.”
“I am pleased to welcome Grace Electron to HDP, joining the outstanding companies working on HDP User Group projects. Their expertise and capability in ultra-low loss materials will contribute significantly to several of our projects, especially those focused on next-generation high-frequency applications”, said Larry Marcanti, Executive Director of HDP User Group.
Suggested Items
Spirit Announces Sale of FMI to Tex Tech Industries
01/14/2025 | Spirit AeroSystems Holdings, Inc.Spirit AeroSystems Holdings, Inc. announced the sale of Fiber Materials Inc (FMI) business based in Biddeford, Maine, and Woonsocket, Rhode Island, to Tex Tech Industries, Inc. (Tex-Tech) for $165 million in cash.
Imec Achieves Breakthrough in Silicon Photonics
01/13/2025 | ImecImec, a world-leading research and innovation hub in nanoelectronics and digital technologies, has announced a significant milestone in silicon photonics with the successful demonstration of electrically-driven GaAs-based multi-quantum-well nano-ridge laser diodes fully, monolithically fabricated on 300 mm silicon wafers in its CMOS pilot prototyping line.
SolderKing to Highlight Innovations in Soldering and Manufacturing Efficiency at Southern Manufacturing & Electronics 2025
01/08/2025 | SolderKing Assembly Materials Ltd,SolderKing, a leading UK manufacturer of advanced soldering materials and consumables, will be exhibiting at the Southern Manufacturing and Electronics Show from 4-6 February 2025 at the Farnborough International Exhibition Centre, Stand J90.
SMTA Announces Wafer-Level Packaging Symposium Program
01/08/2025 | SMTAThe SMTA is excited to announce the technical program for the 2025 Wafer-Level Packaging Symposium. The symposium will be held February 18-20, 2025 at The Hyatt Regency San Francisco Airport in San Francisco, California.
MANA Develops Ferroelectric-ferromagnetic Materials for Next-generation Electronics
01/07/2025 | PRNewswireResearchers at the Research Center for Materials Nanoarchitectonics (MANA) have proposed a method to create ferroelectric-ferromagnetic materials, opening doors to advancing spintronics and memory devices.