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July 2022 Issue of SMT007 Magazine Available Now
July 5, 2022 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute

Data security is now a business imperative. Whether your security plans are defensive (to repel hackers and eliminate data leaks), evolutionary (to support digital factories and industrial automation), or competitive (certifications and new capabilities), you can be either reactive or proactive. In either case, you will most certainly be responding to data security in the near future—whether you like it or not.
In the July issue of SMT007 Magazine, we look at the three main data security initiatives currently under way and ask, “Can this be accomplished affordably?”
Download your copy today on the virtual newsstand or sign up for delivery in your e-mailbox by subscribing here.
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Advanced Packaging-to-Board-Level Integration: Needs and Challenges
09/15/2025 | Devan Iyer and Matt Kelly, Global Electronics AssociationHPC data center markets now demand components with the highest processing and communication rates (low latencies and high bandwidth, often both simultaneously) and highest capacities with extreme requirements for advanced packaging solutions at both the component level and system level. Insatiable demands have been projected for heterogeneous compute, memory, storage, and data communications. Interconnect has become one of the most important pillars of compute for these systems.
Procense Raises $1.5M in Seed Funding to Accelerate AI-Powered Manufacturing
09/11/2025 | BUSINESS WIREProcense, a San Francisco-based industrial automation startup developing cutting-edge AI and remote sensing technologies for process manufacturers has raised $1.5 million in a seed funding round led by Kevin Mahaffey, Business Insider’s #1 seed investor of 2025 and HighSage Ventures, a Boston-based family office that primarily invests in public and private companies in the global software, internet, consumer, and financial technology sectors.
Zuken Announces E3.series 2026 Release for Accelerated Electrical Design and Enhanced Engineering Productivity
09/10/2025 | ZukenZuken reveals details of the upcoming 2026 release of E3.series, which will introduce powerful new features aimed at streamlining electrical and fluid design, enhancing multi-disciplinary collaboration, and boosting engineering productivity.
AI Infrastructure Boosts Global Semiconductor Revenue Growth to 17.6% in 2025
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