Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
Facing the Future: Successfully Navigating the Uncertain Path Ahead
It’s Only Common Sense: Going After the Small Wins Fosters a Winning Culture
IBIDEN Selected for Inclusion in MSCI ESG Leaders Indexes and MSCI Japan ESG Select Leaders Index
July 7, 2022 | IBIDENEstimated reading time: 1 minute
IBIDEN Co, Ltd. is pleased to announce that it has been selected for inclusion in MSCI Inc.'s MSCI ESG Leaders Indexes and MSCI Japan ESG Select Leaders Index.
MSCI ESG Leaders Indexes comprises companies with the highest environmental, social and governance rating in each sector of the parent index, and IBIDEN Co, Ltd. has been selected for inclusion for the second consecutive year.
Regarding the MSCI Japan ESG Select Leaders Index, IBIDEN Co, Ltd. has been included in the index for the sixth consecutive year since its inception.
Also, IBIDEN Co, Ltd. has received the highest AAA rating of a seven point grade scale in the MSCI ESG Ratings assessment (as of June, 2022). The AAA rating was awarded to only 20 of the 305 Japanese companies selected this time.
IBIDEN Group upholds a "harmonious relationship with the natural environment" and the "realization of the progression of society" as key goals in its Corporate Philosophy. The Group has continued to grow by developing products that can lead to solving social problems with its innovative technologies. Considering that contribution to the progression of society and solving social problems through its business are the essence of its Corporate Philosophy, the Group will continue to engage in ESG (environmental, social, and governance) activities.
Share on:
Suggested Items
IDTechEx Highlights Recyclable Materials for PCBs
04/10/2025 | IDTechExConventional printed circuit board (PCB) manufacturing is wasteful, harmful to the environment and energy intensive. This can be mitigated by the implementation of new recyclable materials and technologies, which have the potential to revolutionize electronics manufacturing.
Bridging the Gap Between PCB Designers and Fabricators
04/03/2025 | Stephen V. Chavez, Siemens EDAWith today’s advanced EDA tools, designing complex PCBs in the virtual world does not necessarily mean they can be built in the real world. This makes the relationship between a PCB designer and a fabricator pivotal to the success of a project. In keeping with solid design for manufacturing (DFM) practices, clear and frequent communication is needed to dial and lock in design constraints that meet expectations while addressing manufacturing concerns.
Hitachi Announces Completion of New Production Facility for Semiconductor Manufacturing Equipment
04/01/2025 | JCN NewswireHitachi High-Tech Corporation announced that the new production facility for semiconductormanufacturing equipment (etch systems), which had been under construction since December 2023 in the Kasado area (Kudamatsu City, Yamaguchi Prefecture), was completed and started the operation on March 17, 2025.
Paige Fiet: From Emerging Engineer to Quality at TTM
03/19/2025 | Marcy LaRont, PCB007 MagazinePaige Fiet is a graduate of the IPC Emerging Engineer program and now works at TTM Technologies in Logan, Utah. She was an IPC Student Board Member and has been a columnist for I-Connect007. She is a stellar example and an encouragement to other young engineers about how to be successful in your early career.
IPC APEX EXPO 2025: And So It Begins
03/18/2025 | Nolan Johnson, I-Connect007The IPC APEX EXPO 2025 show floor opens today, but technical, educational, and, of course, standards committee work has been underway during the preceding weekend. In typical spring fashion, the weather has vacillated between sunny and warm to a spot of rain late on Monday afternoon just as many conference goers were headed back to their nearby hotels.