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Absolute EMS is the West Coast Demo Center for Sasinno Selective Solder
July 25, 2022 | Absolute EMS, Inc.Estimated reading time: 1 minute
Absolute EMS, Inc., an award-winning EMS provider of turnkey and consignment manufacturing services, has procured an ANT-i1 selective soldering machine from Sasinno. Because of the quality that the ANT-i1 provides and because Absolute EMS appreciates its partnership with Sasinno, it has now been designated as Sasinno’s West Coast Showroom.
“Our partnership with Sasinno is such that if they wish to bring a guest into the facility, we will provide a technical escort to demonstrate and share our experience with their equipment,” stated Doug Dow, COO. “In return, they keep us abreast of their new technologies and provide us with exceptional support. This successful relationship provides benefits to both parties as well as to potential customers.”
The ANT-i1 enables Absolute EMS to reduce assembly time by eliminating hand soldering, and most importantly, maintaining perfect soldering quality. The system complements the tight tolerances and demanding needs of the company’s customer base.
The ANT-i1 is a compact selective soldering machine with a small footprint of 990 x 1308 mm that features a drop jet flux, bottom preheating and a mechanical selective soldering pump. The system comes standard with Windows 10, a simple-to-use but comprehensive software that quickly and efficiently locates a fluxing/soldering path, allowing fluxing speed, soldering speed, solder height and dwell time to be edited. Also, all flux types, solder types and solder nozzle types can be recorded for future repeat production, and all parameters related to stable soldering quality are monitored, including N2 pressure, N2 flow, purity and more. Generally, this software provides a fully controllable environment for a stable soldering quality with repeatability.
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Klaus Koziol - atgSuggested Items
BTU International Earns 2025 Step-by-Step Excellence Award for Its Aqua Scrub™ Flux Management System
10/29/2025 | BTU International, Inc.BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, has been recognized with a 2025 Step-by-Step Excellence Award (SbSEA) for its Aqua Scrub™ Flux Management Technology, featured on the company’s Pyramax™ and Aurora™ reflow ovens.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
10/31/2025 | I-Connect007I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.