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Suggested Items

SMT Perspectives & Prospects: The Architecture of Winston Churchill’s Leadership

07/24/2026 | Dr. Jennie Hwang -- Column: SMT Perspectives and Prospects
I was recently invited to visit the U.S. Embassy and the Churchill War Rooms in London, where I met Warren Stephens, U.S. ambassador to the UK, and Bank of England Gov. Andrew Bailey. From those modern diplomatic corridors to the stark resolve of a wartime bunker, the experience reminded me that leadership in this ever-shifting global landscape is, at its best, about bridging the wisdom of the past with the realities of the present.

A Case Study in Conquering High Aspect Ratio Features

07/06/2026 | Richard Nichols, GreenSource Engineering
As demand for high-performance electronics is further driven by advances in AI and machine learning, the importance of high aspect ratio (HAR) through-holes in PCBs and IC substrates has become increasingly apparent. These vias play a vital role in enabling vertical interconnections in complex circuit architectures, especially within HDI structures, where maximizing space and enhancing electrical performance are crucial.

Every Layer Interconnect: The Promise, the Pain, and the Practical Limits

07/02/2026 | Anaya Vardya, American Standard Circuits
Every layer interconnect (ELIC) is an architectural statement about how a PCB is built, signaling a fundamental shift in how we think about routing density, vertical interconnect, and the relationship between design and fabrication. To understand what ELIC solves, you have to understand what it replaces. Traditional HDI construction uses a rigid core with sequential build-up layers on one or both sides:configurations such as 2-4-2 or 3-2-3.

Qnity Powers the Transition from Shrink to Stack with Advanced Packaging Solutions

06/23/2026 | Qnity
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, announced the launch of its Advanced Packaging Innovation Hub, underscoring advanced packaging as a strategic growth driver and innovation priority for the company.

Marcy’s Musings: Old School vs. New School—When Does It Matter?

06/17/2026 | Marcy LaRont -- Column: Marcy's Musings
The battle between old and new is nothing new. Throughout history, technological progress has faced skepticism, resistance, and at times, outright hostility. Yet progress tends to win. In his book, "RenAIssance," author and APEX EXPO 2026 keynote Zack Kass illustrates this point beautifully. From hand weaving to sewing machines, from scribes to the printing press, from horse-drawn carriages to automobiles, and now to artificial intelligence, each technological leap has ultimately made our lives more productive and expanded what was possible.
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