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Specialty Coating Systems Introduces IR Thermal Preheating & Curing Systems
July 25, 2022 | Specialty Coating Systems (SCS)Estimated reading time: Less than a minute
Specialty Coating Systems (SCS) is pleased to introduce its new PrecisionHeat infrared radiation (IR) thermal preheating system and PrecisionCure TC IR thermal curing system. Both the PrecisionHeat and PrecisionCure can operate as stand-alone systems or fully integrate with the SCS PrecisionCoat selective conformal coating and dispensing system. The systems feature Windows®-based software with a touchscreen monitor and are designed for continuous operation, requiring minimal downtime for maintenance.
The SCS PrecisionHeat IR thermal preheating system is ideal for heating substrates prior to dispensing underfill materials. The two-zone system has 12 ceramic heaters per zone for even heating. The final zone is equipped with an IR temperature probe, providing users with real-time temperature feedback and control over the heating cycle.
The SCS PrecisionCure TC (IR) thermal curing system provides customers with the reliability and efficiency needed throughout the curing process. Available with two or four heating zones, each zone is heated with 12 ceramic heaters for even zone heating.
The PrecisionCure TC has optional humidity control that incorporates an ultrasonic spray nozzle and humidity sensor to elevate the tunnel’s relative humidity, decreasing the cure time for certain types of materials with a secondary moisture curing mechanism.
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Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.