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Current IssueInner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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Chemcut Granted U.S. Patent
July 26, 2022 | Chemcut CorporationEstimated reading time: Less than a minute
Chemcut Corporation, world leader in wet processing equipment for the manufacture of printed circuit boards and chemical etching of various metals, announces that it has been granted a U.S. Patent and notice of allowance by the United States Patent and Trademark Office (USPTO) for a lightweight roller. This notice is U.S. patent 11,078,025 which provides for the manufacture of a lightweight roller for the movement of fragile or sensitive components such as electronic components and glass.
Chemcut Corporation, founded in 1956, was the original developer of spray etching, a technique that made the chemical etching process practical for volume, as well as prototype production. Chemcut offers a complete line of spray etchers, developers, strippers, waste treatment systems, and auxiliary equipment. More than 15,000 Chemcut units are currently in operation around the world.
To learn more about Chemcut, please call 814-272-2800 or 800-CHEMCUT. Or visit the company’s website at www.chemcut.net.
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The Drive Toward UHDI and Substrates
09/20/2023 | I-Connect007 Editorial TeamPanasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.