I-Connect007 Editor’s Choice: Five Must-Reads for the Week
July 29, 2022 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes
Every now and then, the news becomes the news. This is one of those times.
Our biggest news this week: I-Connect007 has been acquired by IPC. Every member of the team, including founder and Publisher Barry Matties, is included in this deal. We’ve enjoyed working closely with IPC for decades, especially at events like IPC APEX EXPO, and we have four IPC columnists writing in our magazines and newsletters.
This move makes sense for both parties. It enables us to take our magazine, newsletters, and book publishing to the next level, and IPC won’t have to spend years building a media company from the ground up. It really is a win-win.
If you’ve been working with us in any capacity, not much will change, really. Our everyday working routine will just get better. So, it’s pretty big news, but we’ll still be bringing you all the news and technical information you’ve come to expect, but even better than before. Stay tuned!
IPC Acquires Media Company I-Connect007, Strengthening Relationship to Drive Growth and Innovation in the Electronics Industry
Published July 28
Yes, it’s definitely some big news. This marks a vast expansion of the number of experts that Nolan Johnson and I can call upon when we’re planning an issue. “Hey, coworker, what’s this new solder standard all about?” And with greater resources, we’ll be able to do more to help the industry navigate these increasingly crazy times.
Overcoming Electronic Component Supply Chain Disruptions with Spectra
Published July 25
In these times of supply chain disruptions, sourcing components is more difficult than ever. Altium recently launched the Spectra data intelligence environment, which includes the Electronic Design to Delivery Index (EDDI), a free monthly report that combines historical data of components with their current availability, measured against January 2020, a pre-Covid baseline. We can expect to see more tools like this as the supply chain hiccups continue.
PCB Finance Class with Jeff De Serrano
Published July 28
In times like these, it’s not uncommon to wonder, “What the hell is going on?” It’s helpful to remember that this industry has been through much worse than this—and come out stronger. In this interview with Nolan Johnson, PCB Technologies U.S. Operations President Jeff De Serrano walks us through some of the financial turmoil the industry has faced in the last few decades, and he explains why there’s no time like the present to invest in this industry.
American Standard Circuits Focuses on Education with 77 Second Webinars
Published July 26
If your schedule is packed but you still need to stay up to date with technology, American Standard Circuits has just what you need. Its new 77 Second Webinars offer bite-sized chunks of information on topics such as controlled impedance—in a little more than one minute. ASC manages to put quite a bit into 77 seconds. Check it out on YouTube.
IPC Commends House on Passage of CHIPS+ Legislation
Published July 28
Well, what do you know? Congress put aside their differences long enough to do something good for the country: They passed the CHIPS Act. As usual, they’re a little late to the party, but we’ll take what we can get, right? Maybe Washington is finally starting to realize that we need to have a strong domestic supply chain. Let’s hold a good thought!
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.