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'CHIPS Plus' Bill Passed with IPC’s Active Support
August 2, 2022 | IPCEstimated reading time: 1 minute
After years of trying to get the funding for the CHIPS Act passed via several different vehicles, the U.S. Congress acted quickly last week to approve a slimmed-down version of the competitiveness package formerly known as “USICA” and “America COMPETES” before the August recess. In the end, Congress passed the CHIPS and Science Act, the research and development legislation also referred to as “CHIPS Plus”, which includes more than $52 billion for U.S. companies that manufacture semiconductors as well as billions in tax credits to encourage investment in chip manufacturing. It also provides tens of billions of dollars to fund scientific research, innovation, and development of other U.S. technologies. This legislation is expected to be signed by President Biden within the next few days.
IPC advocated strongly for the passage of legislation that would fund the CHIPS Act and urged Congress to include $2.5 billion in the first fiscal year for the National Advanced Packaging Manufacturing Program. IPC applauds both the Senate and the House for reaching an agreement and sending the bill to the President’s desk.
Given the importance of advanced packaging to our industry’s future, IPC is hosting an Advanced Packaging Symposium on October 11-12 at the Kimpton Monaco Hotel in Washington, D.C. Confirmed speakers include senior executives from leading electronics companies, including Intel, AMKOR, Skywater, Schweizer, TTM, Calumet, Northrop Grumman and SEMCO. The participation of senior government officials from the United States and Europe is also in the process of being confirmed. Register today!
Ken Schramko, Senior Director, North American Government Relations, IPC
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
All Flex Solutions Hires Mike Madetzke as Manager of R&D
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Shane Whiteside of Summit Reflects on Today's PCB Landscape
05/08/2024 | I-Connect007 Editorial TeamSummit Interconnect began as a printed circuit board manufacturing company just eight years ago and has seen impressive growth organically and through acquisition. Summit President and CEO Shane Whiteside takes a few moments to share his thoughts on the growing PCB industry in the United States.
America Projected to Triple Semiconductor Manufacturing Capacity by 2032, the Largest Rate of Growth in the World
05/08/2024 | SIAThe Semiconductor Industry Association (SIA), in partnership with the Boston Consulting Group (BCG), released a report on the global chip supply chain that projects the United States will triple its domestic semiconductor manufacturing capacity from 2022—when the CHIPS and Science Act (CHIPS) was enacted—to 2032.
Coherix Partners with EMU on 'Factory of the Future' Technology Program
05/08/2024 | PRNewswireMichigan-based Coherix is working with Eastern Michigan University (EMU) in Ypsilanti to develop "factory-of-the-future" manufacturing and assembly technology.