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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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proteanTecs, MegaChips Partner on Health and Performance Solutions for Next-Gen LSIs

09/04/2026 | BUSINESS WIRE
proteanTecs®, the leading provider of health and performance management solutions for advanced electronics, announced it is collaborating with MegaChips on the integration of proteanTecs’ embedded monitoring technology into MegaChips’ next-generation ASIC and LSI digital systems.

Beyond the Chip: Indium Highlights AI Materials Solutions at SEMICON Taiwan 2026

09/04/2026 | Indium Corporation
As artificial intelligence (AI) and high-performance computing (HPC) continue to accelerate semiconductor innovation, the industry is moving beyond the challenge of building a more powerful chip. Increasingly complex packaging, higher power density, tighter thermal requirements, and demands for faster, more cost-effective manufacturing are making system-level performance and the broader manufacturing ecosystem critical to the next generation of AI.

Koh Young Europe Highlights Smart AI Solutions at EFX Stuttgart

09/04/2026 | Koh Young
Koh Young, the industry leader in True 3D™ measurement-based inspection solutions, will participate in the initial EFX, Expo for Electronics Manufacturing, from October 6 to 8, 2026, at Messe Stuttgart.

TTCI Brings Manufacturing Test Expertise to Keysight UGM in Santa Clara

09/03/2026 | TTCI
The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions for more than 45 years, is pleased to announce that it will exhibit at the Keysight Technologies Manufacturing Test User Group Meeting (UGM) on September 16, 2026, in Santa Clara, California.

Marelli, Microchip Pioneer Open-Standard Display Connectivity for Software-Defined Vehicles

09/03/2026 | PRNewswire
Marelli, a global automotive supplier, and Microchip Technology, a broadline supplier of semiconductors committed to making innovative design easier through total system solutions, announced a new solution that enables graphics and video content generated by a vehicle's central computer to be streamed directly to automotive displays using ASA Motion Link (ASA-ML), an open standard for automotive video connectivity.
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