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Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
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DFI, Inc. Earns IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing
August 3, 2022 | IPCEstimated reading time: Less than a minute
IPC's Validation Services Program has awarded an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML) to DFI, Inc., a leading supplier of high-performance embedded solutions, industrial motherboards and custom products technology, worldwide.
DFI, Inc. met or exceeded the requirements for the electronics industry's most rigorous classification, Class 3, which is intended for dedicated service electronics products. As a result of successfully completing an intensive audit, based on two of IPC's foremost standards: IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610, Acceptability of Electronic Assemblies, DFI, Inc. is now among a trusted source of electronics suppliers found on IPC's QML/QPL database at www.ipcvalidation.org.
DFI, Inc.’s Chief Operating Officer Gavin Chan stated, “The IPC QML 001/610 qualification obtained by the factory in Taoyuan is a significant milestone for DFI as it demonstrates not only our adherence to product quality standards but also our commitment to our customers.”
“We are pleased to recognize DFI, Inc. as a member of IPC's network of trusted suppliers,” said Randy Cherry, director, IPC Validation Services. “By earning the QML, DFI, Inc. shows its commitment to delivering the highest level of quality in electronics manufacturing.”
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SMT007 Magazine November 2025: Inside Mexico’s Rise as an Electronics Manufacturing Leader
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Henger Microelectronics Expands Global Footprint with Major Equipment Shipment to Southeast Asia
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TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
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Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.