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Altus Group Expands Soldering Portfolio with SEHO Partnership

06/22/2026 | Altus Group
Altus Group, a leading distributor of capital equipment for electronics manufacturing in the UK and Ireland, has announced a new partnership with SEHO Systems GmbH, a German manufacturer specialising in wave and selective soldering systems, automation technology as well as THT inspection solutions.

TM Soldering Solutions Launches EmberX Selective Soldering Control Software

06/15/2026 | TM Soldering Solutions
TM Soldering Solutions introduces its powerful EmberX software control package, developed for its PHOENIX Selective Soldering platforms.

Dry Ice Blasting Offers Alternative Cleaning Method

06/15/2026 | Jonathan Dean, Cold Jet
Cleanliness is a critical factor in the production of every electronic component, from wafer fabrication to final product assembly. Unclean surfaces and parts can ruin entire batches of products, negatively affecting product performance, production yield rates, and overall operational costs. Any lapse in production quality or excessive downtime can be detrimental to an electronics manufacturing facility.

MacDermid Alpha Showcases Advanced Soldering Materials for High-Reliability Electronics Assembly at NEPCON Thailand 2026

06/11/2026 | MacDermid Alpha
MacDermid Alpha Electronics Solutions will present its latest materials technologies at NEPCON Thailand 2026, held June 17 to 20 at the Bangkok International Trade & Exhibition Centre (BITEC), Thailand. Recognized as a premier gathering for technology leaders and manufacturers, the event supports one of the world’s most dynamic electronics manufacturing regions.

Trouble in Your Tank: The Role of Organic Solderability Preservatives in Advanced Packaging

06/08/2026 | Michael Carano -- Column: Trouble in Your Tank
Technology trends shaping the electronics industry supply chain—AI, IoT, ADAS, and high-performance computing (HPC)—are driving finer circuit features and higher layer counts. Advanced packaging drives the selection of surface finishes depending on the application. Typical designs require excellent solder joint reliability and wire bondability. It is not uncommon for designers to specify the organic solderability preservatives (OSP) on the BGA side of the substrate and precious-metal-plated finishes on the top side, which facilitate wire bonding.
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