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A New Logistics Center for ICAPE Group in France
August 8, 2022 | ICAPE GroupEstimated reading time: Less than a minute

ICAPE Group inaugurated a new logistics center. With 30% growth in its business volume during the year and an expected increase of 200% in the upcoming years, it was essential to significantly increase the logistics capacities on the site of its head office of Fontenay-Aux-Roses, in the Paris region. It is a 600m2 storage and working space that has been deployed, inside ICAPE Group’s French Headquarters, to ensure a higher level of logistics service.
Beyond the increase in the storage area, it is a battery of new services resulting from this new project. Thus, ICAPE Group customers will be able to benefit from VMI and Call-Off options, an important commercial leverage when it comes to securing its supply chain and controlling all aspects of it over the long term. The quality of the logistics service has also made a big step forward.
With new spaces dedicated to deconsolidation, sorting, and storage, organized according to the volume produced, it is with greater efficiency that on-site teams can process orders. This increased productivity is directly related to the improvement of lead times, which could be reduced by one working day, and the planning of which promises to be even more precise.
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Rules of Thumb: Design007 Magazine, November 2024
11/11/2024 | I-Connect007 Editorial TeamRules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. They’re built on design formulas, fabricators’ limitations, and tribal knowledge. And unfortunately, some longtime rules of thumb should be avoided at all costs. How do we separate the wheat from the chaff, so to speak?
Connect the Dots: Best Practices for Prototyping
09/21/2023 | Matt Stevenson -- Column: Connect the DotsPCB prototyping is a critical juncture during an electronic device’s journey from concept to reality. Regardless of a project’s complexity, the process of transforming a design into a working board is often enlightening in terms of how a design can be improved before a PCB is ready for full production.
The Drive Toward UHDI and Substrates
09/20/2023 | I-Connect007 Editorial TeamPanasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
Asia/Pacific AI Spending Surge to Reach a Projected $78 Billion by 2027
09/19/2023 | IDCAsia/Pacific spending on Artificial Intelligence (AI) ), including software, services, and hardware for AI-centric systems will grow to $78.4 billion in 2027, according to International Data Corporation's latest Worldwide Artificial Intelligence Spending Guide.
Intel to Sell Minority Stake in IMS Nanofabrication Business to TSMC
09/13/2023 | IntelIntel Corporation announced that it has agreed to sell an approximately 10% stake in the IMS Nanofabrication business to TSMC. TSMC’s investment values IMS at approximately $4.3 billion, consistent with the valuation of the recent stake sale to Bain Capital Special Situations.