-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
New Date and Venue for CPCA Show 2022
August 15, 2022 | CPCAEstimated reading time: Less than a minute
In cooperation with the Shanghai municipal government in preventing and controlling the coronavirus pandemic, and to ensure the health and safety of all exhibitors and visitors, the China Printed Circuit Association (CPCA) will postpone the 2022 International Electronic Circuits (Shanghai) Exhibition (CPCA Show 2022), originally scheduled to be held at the National Exhibition and Convention Center (Shanghai) from September 13–15, 2022, to October 12–14, 2022. The event will also be held at a new venue, Shenzhen World Exhibition and Convention Center (Bao'an District).
In line with these changes, the exhibition will have a tentative new name, 2022 International Electronic Circuits (South China) Exhibition. Considered an electronics manufacturing hub in China, Shenzhen will provide a greater platform to showcase and highlight the latest trends and developments happening in the electronics manufacturing industry.
Suggested Items
Delta Electronics, Cal-Comp Strengthen Partnership to Drive Innovation in Industrial Automation
12/25/2024 | Delta ElectronicsDelta Electronics (Thailand) Public Company Limited, a global leader in power management and IoT-based smart green solutions, and Cal-Comp Electronics (Thailand) Public Company Limited (SET Ticker: CCET), a leading industry 4.0+ electronics manufacturing services (EMS) provider, have signed a Memorandum of Understanding (MOU) to deepen their collaboration in industrial automation.
SMT Mounter Market Size Projected to Reach $5.06 Billion by 2030
12/23/2024 | openPRAccording to the new market research report "Global SMT (Surface-mount Technology) Mounter Market Report 2024-2030", published by QYResearch, the global SMT (Surface-mount Technology) Mounter market size is projected to reach USD 5.06 billion by 2030, at a CAGR of 4.7% during the forecast period.
Delta Honored as Top 10 Best Taiwan Global Brands
12/23/2024 | Delta ElectronicsDelta, a global leader in power management and a provider of IoT-based smart green solutions, was selected as one of the “2024 Best Taiwan Global Brands” for the 14th year in a row, ranking among Taiwan's top 10 global brands.
Biden-Harris Administration Announces CHIPS Incentives Award with Samsung Electronics to Solidify U.S. Leadership in Leading-Edge Semiconductor Production
12/23/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce awarded Samsung Electronics (Samsung) up to $4.745 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication facilities.
SIA Praises Finalization of CHIPS Incentives to Supplement SK Hynix’s $3.87 Billion Investment in Indiana
12/20/2024 | SIAThe Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer commending finalization of CHIPS and Science Act manufacturing investments announced by the U.S. Department of Commerce and SK hynix. The incentives will supplement the company’s $3.87 billion investment in Indiana for advanced packaging operations and R&D.