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Advanced Electronics Packaging Digest

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Suggested Items

GlobalFoundries, RAAAM Develop Next-Gen GCRAM on FDX Platform

09/02/2026 | GlobalFoundries
GlobalFoundries (GF) and RAAAM Memory Technologies, a pioneer in advanced on-chip memory solutions, announced a strategic collaboration to develop and qualify Gain-Cell RAM (GCRAM) technology.

Everspin, Teledyne HiRel Partner to Accelerate MRAM Adoption in Aerospace and Defense

09/02/2026 | BUSINESS WIRE
Everspin Technologies, Inc., the world’s leading developer and manufacturer of MRAM solutions, and Teledyne HiRel Semiconductors, a business unit of Teledyne Technologies Incorporated and a leading supplier of high-reliability semiconductor solutions, announced a strategic partnership to accelerate adoption of Everspin’s MRAM in aerospace, defense and other demanding systems.

Yunlin County, Foxconn Launch 'Document Brain' Smart Service

09/01/2026 | Foxconn
The Yunlin County Government and Foxconn Technology Group announced that they have jointly developed the "Document Brain" smart agent service, which has completed its initial phase and achieved fruitful results in improving the efficiency of government administration.

IPC-1751 Builds Supply Chain Infrastructure for the Future

09/01/2026 | Nolan Johnson, I-Connect007
IPC-1751 Committee Chairs Nikki Johnson, VP of operations and regulatory at Source Intelligence, with over 20 years of experience in compliance standards, and Dr. N Nagaraj, a chemical engineer and former NASA contractor who helped develop early IPC compliance solutions, discuss IPC-1751, the newly adopted JSON-based standard that replaces the older XML format. In this roundtable-format conversation, Johnson and Nagaraj explain how IPC-1751 serves as a modular "envelope" that connects related standards (IPC 1752–1757, IPC-1782) for material composition, lab reports, and conflict minerals.

ITAR vs. EAR: When PCB Fabrication Can Move Outside the U.S.

08/31/2026 | Ryan O'Connor, SOMACIS
The difference between ITAR and EAR is often reduced to a simple rule of thumb: ITAR programs must stay in the U.S. (exceptions apply), while EAR programs can be built anywhere. In practice, that distinction is incomplete and often leads to sourcing decisions that introduce compliance risk rather than reducing it. Whether a PCB can be fabricated outside the United States depends not just on whether it is ITAR- or EAR-controlled, but on how the program is classified, what data is involved, who can access it, and how fabrication is executed across locations.
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