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Advanced Electronics Packaging Digest

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Flip Electronics Announces Authorized Distribution Partnership with Intelligent Memory

10/28/2026 | PRNewswire
 Flip Electronics, a global authorized distributor specializing in hard-to-find, discontinued LTB, EOL, aged and obsolete electronic components, announced it has signed an authorized distribution partnership agreement with Intelligent Memory.

Intel to Acquire Classiq to Create a Full-stack Quantum Computing Platform

10/28/2026 | Intel
 Intel Corporation announced that it has entered into a definitive agreement to acquire Classiq, a leading provider of quantum computing software. The combination of Classiq’s synthesis platform with Intel’s spin-qubit manufacturing and existing software would create a user-friendly full-stack quantum computing platform, enabling the promising technology to mature into a mainstream computing business.

Infineon Showcases AI-Era Technologies at electronica 2026

10/14/2026 | Infineon
With artificial intelligence evolving from virtual chatbots into real-world machines and devices, it will shape our lives more than ever.

Applied Materials, Intel Collaborate on AI Chipmaking Innovations

10/08/2026 | Globe Newswire
Applied Materials, Inc., the leader in materials engineering for the semiconductor industry, announced it is working with Intel Corporation to accelerate development of chipmaking innovations for next-generation transistors, interconnects and advanced packaging technologies.

SAIC Acquires Information Security Corp., Expands Zero-Trust and Encryption Capabilities

10/05/2026 | SAIC
Science Applications International Corp., a leading mission integrator supporting defense, space, intelligence, and civilian agencies, announced it has completed the acquisition of Information Security Corporation (ISC).
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