HARMAN Acquires In-cabin Radar Sensing Pioneer CAARESYS
September 6, 2022 | Business WireEstimated reading time: 1 minute
HARMAN International, a wholly-owned subsidiary of Samsung Electronics Co., Ltd. focused on connected technologies for automotive, consumer and enterprise markets, announced the acquisition of CAARESYS, an Israel-based company founded in 2017 that develops vehicle passenger monitoring systems powered by contactless, low-emission radar. CAARESYS has successfully partnered with leading OEMs and provides a mass production solution for cabin monitoring including vital signs sensing, passenger localization and Child Presence Detection (CPD).
The in-cabin radar sensor and algorithm solution from CAARESYS will strengthen HARMAN’s automotive product offerings, building on the company’s strong consumer-centric Digital Cockpit and ADAS solutions. With CAARESYS’ contactless vital signs sensing and real-time insights from that information, HARMAN can now offer new levels of in-vehicle safety, comfort, and well-being in its growing product line.
“With the acquisition of CAARESYS, we gain market-leading in-cabin radar sensing technology and radar-enabled features that can quickly integrate into our products,” said Christian Sobottka, President, Automotive Division, HARMAN. “And by partnering with HARMAN, automakers can deliver the key safety and well-being features that consumers demand – today as opposed to years from now.”
CAARESYS technology utilizes biometrics to detect the location, health condition and state of each vehicle occupant. The non-intrusive sensing system is a small RF radar that can be integrated anywhere in a vehicle cabin. Through its sophisticated radar signaling processing algorithm, the system detects seat occupancy state and monitors passenger biometrics, including respiration rate, heart rate and heart rate variability. CAARESYS technology allows for highly accurate sensing even in the constantly fluctuating driving environment and can operate in static or driving mode.
“It’s with excitement and pride that we join the HARMAN team, especially at this time when they are doing so much to transform what the in-cabin experience can be for consumers,” said Ilya Sloushch, co-founder and CEO of CAARESYS, who will now lead the newly established In-Cabin Radar team at HARMAN. “HARMAN’s successful partnerships with leading automakers will offer unprecedented scale and reach for our technologies and extend the benefits enabled by in-cabin radar to more drivers and passengers than ever before.”
CAARESYS employees will join HARMAN as part of the company's Automotive division. “We extend a warm welcome to our new team members,” said Sobottka, “and we look forward to launching the new products that the CAARESYS team and technology will enable in the HARMAN portfolio.”
Suggested Items
Designing for Cost to Manufacture
11/21/2024 | Marcy LaRont, I-Connect007ICAPE's Richard Koensgen, a seasoned field application engineer with a rich background in PCB technology, shares his journey of working with customers and manufacturers through the intricacies of circuit board development and emphasizes the importance of early-stage collaboration with PCB designers. With a focus on tackling the most challenging aspects of PCB design and manufacturing, he discusses everything from layout considerations to the thermal challenges of today's technology when it comes to designing for cost.
OSI Systems Receives $11M Order for Electronic Assemblies
11/21/2024 | BUSINESS WIREOSI Systems, Inc announced that its Optoelectronics and Manufacturing division has received an order for approximately $11 million to provide critical electronic sub-assemblies for a leading-edge healthcare original equipment manufacturer (OEM), known for innovative and specialized medical solutions.
CHIPS for America Announces Up to $300M in Funding to Boost U.S. Semiconductor Packaging
11/21/2024 | U.S. Chamber of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry.
NTT, Olympus Joint Demonstration Shows IOWN APN's Low-latency Capability
11/21/2024 | JCN NewswireNTT Corporation and Olympus Corporation announced that, following the start of their joint experiment in March of the world’s first cloud endoscope system which processes endoscopic videos on the cloud, they jointly established a cloud endoscopy system utilizing the IOWN APN technology.
Hon Hai Joins OpenUSD Alliance to Promote Standardized and Open Source Universal Scenario Description (USD) Technology
11/21/2024 | Hon Hai Technology GroupHon Hai Technology Group , the world’s largest technology manufacturing and service provider, announced that it has joined the Alliance for OpenUSD (AOUSD ) to support the construction of a 3D ecosystem and promote Cooperation among various industries around the world promotes the standardization of Universal Scene Description (USD ).