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Koh Young Speaking on Improving Performance with CFX-enabled Machine Connectivity at SMTA Guadalajara
September 6, 2022 | Koh YoungEstimated reading time: 1 minute
Koh Young Technology, the industry-leader in True 3D measurement-based inspection solutions and a SMTA Guadalajara chapter sponsor, will be presenting about the benefits of machine connectivity using the IPC-2591 (CFX) standard. Additionally, Koh Young will delivering live demonstrations of its award-winning inspection and measurement solutions at the SMTA Guadalajara Expo and Tech Forum at the EXPO Guadalajara in Jalisco, Mexico during 21-22 September 2022.
“Leveraging IPC-CFX standards can help manufacturers improve their electronics manufacturing process while helping to realize the benefits of a smart factory,” commented Luis Rivera, MES Engineer at Koh Young America and featured speaker at the SMTA Guadalajara Technical Forum. “These tools collect factory data on defects, A person in a green shirt
Description automatically generated with medium confidenceoptimization, traceability, and more to improve metrics, increase quality, and lower costs. Yet, successful CFX implementation on the shopfloor requires confidence that equipment has been qualified to IPC-CFX. We will show how smart factory standards help improve the SMT process.” In his presentation, Luis will explore how Koh Young successfully applies real-time data to improve the production process by converting data into process knowledge using CFX and other software tools. Combined with IPC communication standards, the gates to a smart factory are open to anyone.
Luis will begin his presentation about improving process control with machine connectivity and leveraging CFX to create a smart factory on Wednesday, 21 September 2022 at 12:00 with a question-and-answer session to follow. To learn more about how our solutions boost your quality, visit us at the SMTA Guadalajara in booth 448.
You can register to attend the in-person conference and exposition at SMTA website.
Additional content from Koh Young:
- The Printed Circuit Assembler’s Guide to… SMT Inspection: Today, Tomorrow, and Beyond by Brent Fischthal
- “Converting Process Data Into Intelligence” by Joel Scutchfield and Ivan Aduna, a free 12-part micro webinar series
- You can also view other titles in our full I-007eBooks library.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
TTCI Brings Hands-On Test Engineering and IPC Training Expertise to PCB Carolina 2025
10/31/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB Carolina on Wednesday, November 12, 2025, at the McKimmon Center at NC State University in Raleigh, North Carolina. Attendees can visit Table 4 to say hello to Bert Horner and Bill Graver, and learn more about their test engineering services and technical training programs.
The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver
10/30/2025 | The Training Connection LLCThe Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.
Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.