Beyond the Board: What Companies Need to Know Before Entering the MilAero PCB Market
Defense Speak Interpreted: If CHIPS Cuts Back, What Happens to Electronics Packaging Funds?
American Made Advocacy: Where’s the Budget for a Modern Military Run on Microelectronics?
Teledyne FLIR Debuts SIRAS Drone for Public Safety and Industrial Inspection
September 7, 2022 | Business WireEstimated reading time: 1 minute
Teledyne FLIR, part of Teledyne Technologies Incorporated, launched SIRAS, a professional drone that includes a quick-connect dual radiometric thermal and visible camera payload. Engineered for data security, performance, and affordability, SIRAS is optimized for industrial and utility inspection, public safety, firefighting, and search and rescue missions.
“Designed to provide pilots with flexibility to get the job done, SIRAS delivers a geofence-free flight experience with thermal and visible imaging capabilities at $9,695 USD,” said, Mike Walters, vice president, product management, Teledyne FLIR. “SIRAS is the only enterprise drone to currently incorporate the patented MSX® technology, which overlays the edge detail from the visible camera on the thermal image to provide critical information in real time.”
The IP-54-rated aircraft features a 31-minute flight time, radar-based front collision avoidance, and backpack portability, so professional UAV pilots can fly safely when and where the mission demands. The included Vue® TV128 payload features a quick-connect gimbal, which provides imagery compatible with FLIR Thermal Studio™ and leading third-party photogrammetry applications. The 16MP visible camera can zoom 128x to pinpoint details. The integrated 640x512 pixel, radiometric Boson® provides best-in-class thermal imagery, 5x digital zoom, and temperature-measurement of every pixel in the scene.
With a startup time of one minute, pilots can get eyes on the scene quickly and maintain control via a dual-band radio (2.4/5.8 GHz) connection, while hot swappable batteries ensure efficient operation. To improve data security, SIRAS stores imagery on an onboard SD card and does not include cloud connection capability. Furthermore, pilots are not required to create an online profile, increasing ease of use and reducing potential unintended online data access.
The SIRAS aircraft was designed in collaboration with and is manufactured by Coretronic Intelligent Robotics Corporation (CIRC) in Taiwan, a subsidiary of Coretronic Group. Final payload integration and quality control are completed in the USA.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Soaring Inference AI Demand Triggers Severe Nearline HDD Shortages; QLC SSD Shipments Poised for Breakout in 2026
09/16/2025 | TrendForceTrendForce’s latest investigations reveal that the massive data volumes generated by AI are straining the global infrastructure of data center storage.
Advanced Packaging-to-Board-Level Integration: Needs and Challenges
09/15/2025 | Devan Iyer and Matt Kelly, Global Electronics AssociationHPC data center markets now demand components with the highest processing and communication rates (low latencies and high bandwidth, often both simultaneously) and highest capacities with extreme requirements for advanced packaging solutions at both the component level and system level. Insatiable demands have been projected for heterogeneous compute, memory, storage, and data communications. Interconnect has become one of the most important pillars of compute for these systems.
Procense Raises $1.5M in Seed Funding to Accelerate AI-Powered Manufacturing
09/11/2025 | BUSINESS WIREProcense, a San Francisco-based industrial automation startup developing cutting-edge AI and remote sensing technologies for process manufacturers has raised $1.5 million in a seed funding round led by Kevin Mahaffey, Business Insider’s #1 seed investor of 2025 and HighSage Ventures, a Boston-based family office that primarily invests in public and private companies in the global software, internet, consumer, and financial technology sectors.
Zuken Announces E3.series 2026 Release for Accelerated Electrical Design and Enhanced Engineering Productivity
09/10/2025 | ZukenZuken reveals details of the upcoming 2026 release of E3.series, which will introduce powerful new features aimed at streamlining electrical and fluid design, enhancing multi-disciplinary collaboration, and boosting engineering productivity.
AI Infrastructure Boosts Global Semiconductor Revenue Growth to 17.6% in 2025
09/09/2025 | IDCAccording to the Worldwide Semiconduct o r Technology and Supply Chain Intelligence service from International Data Corporation (IDC), worldwide semiconductor revenue is expected to reach $800 billion in 2025, growing 17.6% year-over-year from $680 billion in 2024. This follows a strong rebound in 2024, when revenue grew by 22.4% year-over-year.