-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueIt's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
Fueling the Workforce Pipeline
We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
Inner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
September 9, 2022 | Andy Shaughnessy, I-Connect007Estimated reading time: 2 minutes

It feels like the first day of school. It’s September, and we’re all officially back at our desks, workstations, or kitchen tables. Even Les Vacances is over. Oui, c’est vrai!
But instead of facing new teachers, we have to deal with diverse market forces, supply chain issues, and technology that never seems to stop evolving. Of course, that’s what makes this industry so interesting, isn’t it?
This week we highlight some news from industry organizations, an update on the CHIPS Act, and a few columns that focus on failures and what we can learn from them. As Dan Beaulieu points out, failure is an important part of succeeding in the long run, and our industry needs to stop being so “failure-phobic.”
Hold on to your hats, folks. It’s going to be a busy fall! See you in a few weeks.
IPC APEX EXPO 2023 Offers New Courses, New Instructors, and IPC E-Textiles
Published September 9
Today, registration opened for IPC APEX EXPO 2023 in San Diego, slated for Jan. 21–26, 2023. Co-located with the IPC E-Textiles conference on Jan. 23, 2023, the theme for the show is “Advances in a New Era.” The event will feature conference tracks for PCB design, fabrication, and assembly, and we’ll see the return of the PCB design competition as well.
This marks the last IPC APEX EXPO in San Diego for a few years; the show will be held at the Anaheim Convention Center from 2024 through 2026.
Will Marsh: CHIPS Act Update
Published September 6
In one of the few bipartisan efforts to take place in Washington lately, the CHIPS Act was voted through Congress and signed into law by the president. Color me skeptical, but what happens after this whole Kumbaya vibe has faded and it’s time to get to work? Editor Nolan Johnson asks PCBAA President Will Marsh to explain what’s next for this endeavor, and Will fills us in on details of the Supporting American Printed Circuit Boards Act of 2022 as well.
It’s Only Common Sense: It’s Time to Fail
Published September 5
Columnist Dan Beaulieu had a great piece this week on the importance of failing, and being able to learn from our failures. Too often, this industry places a premium on succeeding right now, on the first attempt, and woe to those who suffer a snafu or two along the way. Dan takes a look at some of the failures suffered by people who are now household names, including Henry Ford, Jerry Seinfeld, and Michael Jordan. My favorite MJ story: He missed 9,000 shots in his career.
EIPC Technical Snapshot Webinar
Published September 7
In keeping with the back-to-school theme, EIPC is offering a Technical Snapshot Webinar on Sept. 14 at 15:00 CET. Moderated by EIPC President Alun Morgan, the webinar features four 15-minute presentations, followed by a Q&A session. It’s free to EIPC members and only 50 euros for non-members. Don’t be tardy.
X-Rayted Files: My Favorite BGA Assembly Ever, Part 3
Published September 7
In his latest column, Bill Cardoso discusses his “favorite BGA assembly ever.” As he points out, it’s not his fave because it worked wonderfully; on the contrary, it has so many defects that it’s a perfect illustration of the problems he encounters in BGA assembly every day. Do you have a similar “favorite” PCB project that failed so badly that it’s a textbook example of what not to do?
Suggested Items
Intel Appoints Lip-Bu Tan as Chief Executive Officer
03/13/2025 | Intel CorporationIntel Corporation announced that its board of directors has appointed Lip-Bu Tan, an accomplished technology leader with deep semiconductor industry experience, as chief executive officer, effective March 18.
IMAPS and DPC: 21 Years of Elevating Technical Knowledge
03/13/2025 | Marcy LaRont, I-Connect007The IMAPS 21st Device Packaging Conference (DPC) may have taken place at a conference center located down an idyllic desert road showcasing the best of what native Arizona has to offer, but the topics at this conference were anything but laid-back. This important platform for professionals in microelectronics and advanced packaging set the stage for a technology in high demand. Brian Schieman, IMAPS executive director, says the show was organized to demonstrate their commitment to addressing current technological trends and with significant energy directed toward fostering connections within the supply chain.
KYZEN Announces the Retirement of Longtime Executive Vice President Tom Forsythe
03/13/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, announces the retirement of Tom Forsythe, Executive Vice President, effective December 31, 2024, after more than three decades of service to the company and the electronics manufacturing industry.
Technica USA Celebrates 40 Years of Excellence in Electronics Manufacturing
03/13/2025 | Technica USATechnica USA, a leading provider of materials, equipment, installation, and services for the printed circuit board (PCB) fabrication, PCB Assembly, substrates, MEMS, and semiconductor industries, proudly announces its 40th anniversary in 2025.
INEMI Launches Study of AOI Inspection for Fine Pitch Substrates Seeking Industry Participation
03/11/2025 | iNEMIThe fine lines and spaces of increasingly popular heterogeneous SiP packages, coupled with larger panel sizes and more substrate layers, demand increased capabilities from automated optical inspection (AOI) equipment to accurately detect, characterize and reject true defects without over-rejections.