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PCB Designers to Vie for Design Champion Title at IPC APEX EXPO 2023
September 13, 2022 | IPCEstimated reading time: 1 minute
For the second consecutive year, IPC is hosting an IPC Design Competition, inviting printed circuit board designers to compete to become the IPC Design Champion of 2023. The IPC Design Competition is composed of two heats – a virtual preliminary heat and an in-person layout final for the three top competitors on January 24, 2023 at IPC APEX EXPO in San Diego, California.
“This year, we're kicking things up a notch with more advanced designs, travel stipends for finalists, and cash prizes,” said Patrick Crawford, manager, design standards and related industry programs. “Anyone with an interest in board design can register, but we’re recommending the hobbyists and professionals alike have several years of experience designing boards and a familiarity with and ability to implement IPC standards requirements. Access to an ECAD tool is a must for the first heat,” added Crawford.
The preliminary heat will be held October 17 to November 18, 2022, allowing designers to use their preferred tools to complete a full board buildup within 25 days. Provided with only a schematic, a BOM (bill of materials) and a scope of work document, competitors will be responsible for returning a Gerber file package of a completed design and judged against their interpretation and implementation of design per IPC standards and general DFX (design for excellence) principles. Three finalists will be invited to participate in the four-hour layout final at IPC APEX EXPO 2023. In the final round, competitors will be given a partially complete Altium Design project file and will have four hours to complete a layout including design rule specification, routing, and component placement.
Registration for the IPC Design Competition is free and closes October 13, 2022. For more information, including eligibility requirements, information on preliminary and final heats and registration form, click here.
About IPC
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its more than 3,000 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry.
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Advanced Electronics Packaging Digest: Third Issue Arrives November 17
11/12/2025 | I-Connect007The third issue of Advanced Electronics Packaging Digest launches Monday, November 17. This issue continues AEPD’s mission to deliver forward-looking analysis and insider perspectives on the technologies reshaping advanced electronics packaging. Among the highlights is a review of IMPACT 2025, where discussions on component-to-system-level integration took center stage as experts explored the challenges and breakthroughs driving advanced packaging technologies.
Electronic Design Automation (EDA) Market Size to Reach $811.1 Million by 2030
11/12/2025 | PRNewswireThe Global Electronic Design Automation (EDA) Market was estimated to be worth USD 541 Million in 2023 and is forecast to a readjusted size of USD 811.1 Million by 2030 with a CAGR of 6.4% during the forecast period 2024-2030.
The Technical Backbone of an EMS Company: A CEO’s Perspective
11/12/2025 | Jay Rupani, Precision PCBAs the CEO of an EMS company, I often say that our business runs on precision, innovation, and trust. Behind every finished product—whether it’s a medical device, an automotive control module, or a consumer gadget—lies a sophisticated technical ecosystem that makes it all possible. From design support and process engineering to automation, data analytics, and supply chain integration, the technical side of EMS is where our value truly shines.
ASE Unveils IDE 2.0 – AI-Enhanced Platform Accelerates Package Design Accuracy and Innovation
11/12/2025 | ASE GroupAdvanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd., announced the launch of IDE 2.0, a major upgrade to its Integrated Design Ecosystem™ (IDE) platform.
Elementary, Mr. Watson: The Four Horsemen of Copper Confusion
11/12/2025 | John Watson -- Column: Elementary, Mr. WatsonIf there were a PCB Design Dictionary of Confusing Terms, the cover would feature four words that have baffled generations of engineers: polygons, pours, planes, and floods—or what I refer to as the four horsemen of copper confusion. They sound simple, as if they belong in a geometry textbook or a weather report, but in PCB design, they overlap, develop, and sound interchangeable until you realize they aren't.