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In this issue, we discuss some of the challenges, pitfalls and mitigations to consider when designing non-standard board geometries. We share strategies for designing odd-shaped PCBs, including manufacturing trade-offs and considerations required for different segments and perspectives.
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PCB Designers to Vie for Design Champion Title at IPC APEX EXPO 2023September 13, 2022 | IPC
Estimated reading time: 1 minute
For the second consecutive year, IPC is hosting an IPC Design Competition, inviting printed circuit board designers to compete to become the IPC Design Champion of 2023. The IPC Design Competition is composed of two heats – a virtual preliminary heat and an in-person layout final for the three top competitors on January 24, 2023 at IPC APEX EXPO in San Diego, California.
“This year, we're kicking things up a notch with more advanced designs, travel stipends for finalists, and cash prizes,” said Patrick Crawford, manager, design standards and related industry programs. “Anyone with an interest in board design can register, but we’re recommending the hobbyists and professionals alike have several years of experience designing boards and a familiarity with and ability to implement IPC standards requirements. Access to an ECAD tool is a must for the first heat,” added Crawford.
The preliminary heat will be held October 17 to November 18, 2022, allowing designers to use their preferred tools to complete a full board buildup within 25 days. Provided with only a schematic, a BOM (bill of materials) and a scope of work document, competitors will be responsible for returning a Gerber file package of a completed design and judged against their interpretation and implementation of design per IPC standards and general DFX (design for excellence) principles. Three finalists will be invited to participate in the four-hour layout final at IPC APEX EXPO 2023. In the final round, competitors will be given a partially complete Altium Design project file and will have four hours to complete a layout including design rule specification, routing, and component placement.
Registration for the IPC Design Competition is free and closes October 13, 2022. For more information, including eligibility requirements, information on preliminary and final heats and registration form, click here.
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its more than 3,000 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry.
Siemens Joins Semiconductor Education Alliance to Address Skills and Talent Shortage in Global Semiconductor Industry02/29/2024 | Siemens Digital Industries
Siemens Digital Industries Software announced today it has joined the Semiconductor Education Alliance to help build and nurture thriving communities of practice across the integrated circuit (IC) design and Electronic Design Automation (EDA) industries, from teachers and schools to universities, publishers, educational technology companies and research organizations.
At DesignCon, the I-Connect007 Editorial Team met with Brad Griffin, product marketing group director for the System Analysis Group at Cadence Design Systems. Brad explains how this analysis tool enables designers to address SI and PI issues early in the design process, before they become costly errors, and why he believes his late co-worker Dennis Nagel would be proud to see his efforts come to fruition.
Sondrel, a leading provider of ultra-complex chips for leading global technology brands, announces that it has secured two new contracts to supply Design Consultancy Services for a Network processor chip and a Radio Transceiver chip.
With the seemingly endless ways that electronic products are worming their way into our lives, what was once “nice to own” is increasingly considered indispensable. The capabilities of these products have been driven by relentless improvements at every level of the manufacturing chain, from individual transistors (which are approaching Angstrom levels) to systems the size of buildings supporting Bitcoin mining and increasingly distributed AI products.
Indium Corporation to Showcase Proven EV Products and High-Reliability Alloys at Productronica China02/28/2024 | Indium Corporation
As a materials pioneer and trusted partner in electric vehicle (EV) and e-Mobility manufacturing, Indium Corporation is proud to showcase its high-reliability alloys and soldering solutions at Productronica China, March 20-22, in Shanghai.