-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Spotlight on Mexico
Mexico isn’t just part of the electronics manufacturing conversation—it’s leading it. From growing investments to cross-border collaborations, Mexico is fast becoming the center of electronics in North America. This issue includes bilingual content, with all feature articles available in both English and Spanish.
Production Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Cybord Announces New OEM Partnership with Siemens Digital Industries Software
September 14, 2022 | PRNewswireEstimated reading time: 2 minutes
Cybord, an inline visual AI electronic component analytics software leader that implements AI & Big Data technology, announced it has signed a new Original Equipment Manufacturer (OEM) partnership with Siemens Digital Industries Software, which will now offer the Cybord AI visual analytics solution.
Cybord Announces New OEM Partnership with Siemens Digital Industries Software. Cybord is an inline visual AI electronic component analytics software leader that implements AI & Big Data technology. Meet us at Electronica Munich 2022, Boot C3.368.
Electronic components' authenticity, quality, and reliability are at the core of performance for every circuit board and, by extension, every electronic product. However, this sophisticated industry (unlike mechanical industries) does not always inspect and provide traceability for the components it uses, neither prior to nor during manufacturing. This can result in product failures, high return rates, and large-scale recalls that can cost billions of dollars.
Cybord disrupts the industry by setting a new standard in component analytics and traceability. The company delivers advanced AI and Big Data software that visually analyzes, qualifies and tracks every component and every electronic board.
The Cybord inline visual AI solution is being offered as part of Siemens' manufacturing analytics solutions for electronic manufacturers. It can be integrated as part of a Manufacturing Execution System (MES) system or as a standalone solution.
"Our strong partnership with Siemens amplifies the value of Cybord's platform and expands our market reach," said Zeev Efrat, CEO of Cybord. "We are looking forward to working with Siemens to bring the power of our combined solution to electronics manufacturers across the industry."
The unique advantage of the Cybord inline visual AI solution is that it uses SMT machines' component imaging for visual verification and analyzes 100% of the electronic components at production before they are placed on the circuit board, without changing SMT throughput.
Cybord is available to the production line operators and electronic manufacturers, providing production data analytics and verification to all stakeholders.
Izik Avidan, Analytics Business Unit Manager, Digital Manufacturing, at Siemens Digital Industries Software, said: "The Cybord SaaS solution helps fill a key gap by providing electronics manufacturers with an accurate and scalable way to help confirm that all PCB components are authentic and with satisfactory quality. This is even more necessary today with many manufacturers being forced to source components from new or less-familiar suppliers due to the ongoing supply chain disruption."
He continued: "With this solution, our customers can gain increased transparency over their components, enabling them to reduce risk through more comprehensive validation."
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Designers Notebook: Power and Ground Distribution Basics
10/29/2025 | Vern Solberg -- Column: Designer's NotebookThe principal objectives to be established during the planning stage are to define the interrelationship between all component elements and confirm that there is sufficient surface area for placement, the space needed to ensure efficient circuit interconnect, and to accommodate adequate power and ground distribution.
PCBA Market Poised to Reach $147.5 Billion by 2035
10/20/2025 | Globe NewswireGlobal printed circuit board assembly market is projected to reach $147.5 billion by 2035, at a CAGR of 4.7% during the forecast period 2025-2035
Würth Elektronik Participates in EU Initiative PROACTIF for Cutting-edge Drone and Robotics Solutions
10/14/2025 | Wurth ElektronikWürth Elektronik is a partner in the visionary EU project PROACTIF, funded under the Chips Joint Undertaking (Chips JU). The international consortium of 42 partners from 13 countries aims to strengthen Europe’s technological sovereignty i
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Sumitomo Riko Boosts Automotive Design Efficiency 10x with Ansys AI Simulation Technology
10/13/2025 | SynopsysSumitomo Riko is implementing Ansys, part of Synopsys, Inc. AI technology to accelerate time-to-solution and improve efficiency during the design and manufacturing of automotive components.