Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
MacDermid Alpha to Feature Latest Low Temperature Solutions at SMTA Guadalajara and SMTA Empire Expos
September 15, 2022 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions, will present two papers on its latest low temperature solutions at upcoming SMTA Expos, the first at SMTA Guadalajara which will be held at the Expo Guadalajara from September 21 – 22, and the second at the SMTA Empire in New York on September 27.
Francisco Gallegos, Customer Technical Support Engineer at MacDermid Alpha will present the paper, ‘Low Temperature Soldering: Traditional Sn-Bi based alloys and latest developments in high reliability alloys for SMT and PTH applications’ at 10.30am CT on Wednesday 21st September at the SMTA Guadalajara Expo. The paper will discuss MacDermid Alpha’s latest low temperature innovation, ALPHA OM-565 HRL3 solder paste. Designed to mitigate warpage induced defects in temperature sensitive chip-scale packages, the solder paste enables peak reflow of 175°C to minimize post reflow defects such as Non-Wet-Open (NWO) and Head-in-Pillow (HiP).
Lily Zeiler, District Sales Manager for Northeast US at MacDermid Alpha will present, ‘Low Temperature Soldering: Why LTS is Now a Potential and Viable Option for Many Applications’ at 1:00pm EST on Tuesday 27th September at the SMTA Empire Expo. The paper will discuss how by enabling lower peak reflow temperatures, low temperature solders offer manufacturers considerable process, reliability, and sustainability benefits for a broad range of applications.
In addition to its low temperature technologies, including ALPHA OM-565 HRL3, MacDermid Alpha will also promote its range of ALPHA HiTech adhesives, underfills, edgebonds and encapsulants at both expos. The ALPHA HiTech range of polymer materials are designed to provide enhanced protection for assembled chip components for a broad range of applications including automotive, camera module and mobile. Also featured will be MacDermid Alpha’s Reclaim and Recycling Program, which provides a safe and efficient service enabling customers to meet their environmental and legislative requirements, and at the same time maximize the return on their waste streams.
Visit MacDermid Alpha at booth #300 at the SMTA Guadalajara Expo and the MacDermid Alpha table at SMTA Empire for more information on our high reliability and low temperature solutions. To register for these SMTA Expos please visit: Events - SMTA.
Download The Printed Circuit Assembler’s Guide to… Low-Temperature Soldering by Morgana Ribas. You can also view other titles in our full I-007eBooks library.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
Koh Young, Fuji, and Kurtz ERSA Drive Smart Manufacturing Solutions for EV and Automotive Electronics at Kunshan, China Technical Seminar
09/11/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, partnered with Fuji Corporation and Kurtz ERSA to host an exclusive technical seminar for leading automotive manufacturers in East China. Held on September 4 at Fuji’s factory in Kunshan, the event gathered participants representing over 35 companies.
MacDermid Alpha Presents at SMTA New Delhi, Bangalore Chapter, on Flux–OSP Interaction
09/09/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha contributes technical insights on OSP solderability at the Bangalore Chapter, SMTA reinforcing commitment to knowledge-sharing and industry collaboration.
Electra’s ElectraJet EMJ110 Inkjet Soldermask Now in Black & Blue at Sunrise Electronics
09/08/2025 | Electra Polymers LtdFollowing the successful deployment of Electra’s Green EMJ110 Inkjet Soldermask on KLA’s Orbotech Neos™ platform at Sunrise Electronics in Elk Grove Village, Illinois, production has now moved beyond green.
Absolute EMS: The Science of the Perfect Solder Joint
09/05/2025 | Absolute EMS, Inc.Absolute EMS, Inc., a six-time award-winning provider of fast turnaround, turnkey contract electronic manufacturing services (EMS), is drawing attention to the critical role of 3D Solder Paste Inspection (SPI) in ensuring the reliability of both FLEX and rigid printed circuit board assemblies (PCBAs).