-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
MacDermid Alpha to Feature Latest Low Temperature Solutions at SMTA Guadalajara and SMTA Empire Expos
September 15, 2022 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
MacDermid Alpha Electronics Solutions, a global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions, will present two papers on its latest low temperature solutions at upcoming SMTA Expos, the first at SMTA Guadalajara which will be held at the Expo Guadalajara from September 21 – 22, and the second at the SMTA Empire in New York on September 27.
Francisco Gallegos, Customer Technical Support Engineer at MacDermid Alpha will present the paper, ‘Low Temperature Soldering: Traditional Sn-Bi based alloys and latest developments in high reliability alloys for SMT and PTH applications’ at 10.30am CT on Wednesday 21st September at the SMTA Guadalajara Expo. The paper will discuss MacDermid Alpha’s latest low temperature innovation, ALPHA OM-565 HRL3 solder paste. Designed to mitigate warpage induced defects in temperature sensitive chip-scale packages, the solder paste enables peak reflow of 175°C to minimize post reflow defects such as Non-Wet-Open (NWO) and Head-in-Pillow (HiP).
Lily Zeiler, District Sales Manager for Northeast US at MacDermid Alpha will present, ‘Low Temperature Soldering: Why LTS is Now a Potential and Viable Option for Many Applications’ at 1:00pm EST on Tuesday 27th September at the SMTA Empire Expo. The paper will discuss how by enabling lower peak reflow temperatures, low temperature solders offer manufacturers considerable process, reliability, and sustainability benefits for a broad range of applications.
In addition to its low temperature technologies, including ALPHA OM-565 HRL3, MacDermid Alpha will also promote its range of ALPHA HiTech adhesives, underfills, edgebonds and encapsulants at both expos. The ALPHA HiTech range of polymer materials are designed to provide enhanced protection for assembled chip components for a broad range of applications including automotive, camera module and mobile. Also featured will be MacDermid Alpha’s Reclaim and Recycling Program, which provides a safe and efficient service enabling customers to meet their environmental and legislative requirements, and at the same time maximize the return on their waste streams.
Visit MacDermid Alpha at booth #300 at the SMTA Guadalajara Expo and the MacDermid Alpha table at SMTA Empire for more information on our high reliability and low temperature solutions. To register for these SMTA Expos please visit: Events - SMTA.
Download The Printed Circuit Assembler’s Guide to… Low-Temperature Soldering by Morgana Ribas. You can also view other titles in our full I-007eBooks library.
Suggested Items
Indium Corporation to Showcase Precision Gold Solder Solutions at MEDevice Silicon Valley 2024
11/18/2024 | Indium CorporationIndium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 20-21 in Silicon Valley, California. AuLTRA® MediPro is a family of high-performance, precision gold solder solutions for critical medical applications.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
11/14/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Silicon Valley Expo & Tech Forum taking place on December 5 at the Fremont Marriott Silicon Valley in Fremont, California.
Data-driven Precision in PCBA Manufacturing
11/13/2024 | Julie Cliche-Dubois, CogiscanThe intricacies involved in electronics manufacturing require more than just expensive equipment and skilled technicians; they necessitate an accurate understanding of the entire production flow, informed and driven by access and visibility to reliable data.
Rehm Thermal Systems Mexico Wins the Mexico Technology Award 2024 in the Category Convection Soldering
11/13/2024 | Rehm Thermal SystemsRehm Thermal Systems Mexico has won the Mexico Technology Award in the category convection soldering with the patented mechatronic curtain for convection soldering systems.
SMTA: Capital Chapter & Connecticut Chapter Joint Technical Webinar
11/12/2024 | SMTAThe SMTA Capital Chapter is co-hosting a free webinar for SMTA members with the SMTA Connecticut Chapter on Tuesday, November 19 at 11:00 a.m. EST.