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IPC Training Course on PCB Design for HDI and Advanced Packaging
September 15, 2022 | IPCEstimated reading time: Less than a minute
IPC will be holding an online training course on printed circuit board (PCB) design for HDI and advanced packaging. This course will provide the skills necessary to create PWB/PBA designs that require advanced or complex packaging—including boards with limited board area that must comply with IPC standards and require non-orthogonal placement and routing; non-standard board outline geometry; non-standard board mounting; and advanced board materials.
Taught by an IPC-certified industry expert, the six-week program—to be held from October 27 to November 23 (every Mondays and Wednesdays at 11:00 am to 1:00 pm)—utilizes interactive webinars, on-demand recorded class sessions, job-specific exercises, and team projects to facilitate mastery of the key concepts required by circuit board designers.
This course is ideal for individuals who need further experience with packaging and routing challenges involved with modern high density, reduced board area, and complex geometry designs.
Upon completion, participants will be able to compress circuit topology while maintaining circuit performance; understand the trade-off of advanced PCB materials; define a board stackup that take implements micro-vias; define and implement non-standard (non-orthogonal) parts placement and routing; and define non-standard PCB mechanical retention and keep-outs.
For more information or to register, click here.
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