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Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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Rogers Corporation Highlights Advanced Materials at Defense TechConnect Summit & Expo
September 19, 2022 | Rogers CorporationEstimated reading time: 1 minute
Rogers Corporation will exhibit its advanced material solutions for Aerospace & Defense markets at the Defense TechConnect Summit & Expo 2022, Booth # 513, at the Gaylord National Hotel & Convention Center, in National Harbor, MD, Sept. 27-28, 2022.
Learn more about Rogers’ multilayer copper clad laminate solutions and formable/shaped dielectric systems designed to meet smaller size, weight, and power (SWaP) requirements in complex electronic assemblies; advanced magneto dielectric systems (MAGTREX® laminates) for impressive miniaturization of antennas and other electromagnetic (EM) assemblies; and novel dielectric composite materials for use in 3D additive manufacturing processes that can expand the performance of antennas and sensor systems. Rogers develops material solutions for enhanced signal integrity (SI), improved EM performance and thermal management of critical electronic applications.
Rogers Corporation continues to develop material solutions for the changing needs of electronic industries and will bring an experienced team of technologists to Defense TechConnect Innovation Summit & Expo to help present and enable prospective partners to meet and exceed their system requirements. The popular expo is a global forum for Rogers to showcase their technologies, materials, engineering capabilities, and advanced solutions and invite in-booth discussions concerning the challenges posed by current and emerging applications, and how Rogers’ unique materials solutions can help overcome these challenges.
“Rogers’ commitment to the aerospace and defense electronics industry transcends our traditional laminate materials. We are pleased to introduce to the innovation community the advanced material solutions and capabilities Rogers can employ to solve complex challenges faced by our partners. I hope to see many of you at the show.” – John Ekis, Market Segment Director.
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Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
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The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
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