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In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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Rogers Corporation Highlights Advanced Materials at Defense TechConnect Summit & Expo
September 19, 2022 | Rogers CorporationEstimated reading time: 1 minute
Rogers Corporation will exhibit its advanced material solutions for Aerospace & Defense markets at the Defense TechConnect Summit & Expo 2022, Booth # 513, at the Gaylord National Hotel & Convention Center, in National Harbor, MD, Sept. 27-28, 2022.
Learn more about Rogers’ multilayer copper clad laminate solutions and formable/shaped dielectric systems designed to meet smaller size, weight, and power (SWaP) requirements in complex electronic assemblies; advanced magneto dielectric systems (MAGTREX® laminates) for impressive miniaturization of antennas and other electromagnetic (EM) assemblies; and novel dielectric composite materials for use in 3D additive manufacturing processes that can expand the performance of antennas and sensor systems. Rogers develops material solutions for enhanced signal integrity (SI), improved EM performance and thermal management of critical electronic applications.
Rogers Corporation continues to develop material solutions for the changing needs of electronic industries and will bring an experienced team of technologists to Defense TechConnect Innovation Summit & Expo to help present and enable prospective partners to meet and exceed their system requirements. The popular expo is a global forum for Rogers to showcase their technologies, materials, engineering capabilities, and advanced solutions and invite in-booth discussions concerning the challenges posed by current and emerging applications, and how Rogers’ unique materials solutions can help overcome these challenges.
“Rogers’ commitment to the aerospace and defense electronics industry transcends our traditional laminate materials. We are pleased to introduce to the innovation community the advanced material solutions and capabilities Rogers can employ to solve complex challenges faced by our partners. I hope to see many of you at the show.” – John Ekis, Market Segment Director.
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12/18/2024 | Jerome Larez -- Column: Global PCB ConnectionsAs a PCB field applications engineer, ensuring smooth communication between PCB designers and fabricators is one of my frequent challenges. A critical part of that dialogue is design for manufacturing (DFM). Many designers, even experienced ones, often misunderstand or overlook important DFM considerations. They may confuse design rules with manufacturing minimums, leading to technically feasible designs that are difficult or costly to produce. In this column, I will clarify some common DFM guidelines and help designers understand the difference between “design rules” and “minimums” while sharing best practices that will simplify the production process and ensure the highest quality PCB.
Sayonara to the Last Standing Copper Foil Plant in North America
12/17/2024 | Marcy LaRont, I-Connect007In July 2021, PCB007 Magazine published an interview with Michael Coll and Chris Stevens of Nippon Denkai about the new acquisition by Nippon Denkai of the last-standing ED foil manufacturer in North America. The plant in Augusta, Georgia, was formerly owned by Oak Mitsui, Inc. and had been purchased by Nippon Denkai the previous March, after which significant investment was made with the expectation of providing more jobs.
SCHMID Group Unveils Enhanced InfinityLine H+ for Electroless Copper Deposition
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OKI Develops PCB Technology with Stepped Copper Coin Insertion to Achieve 55 Times Better Heat Dissipation in Outer Space
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Fresh PCB Concepts: PCB Plating Process Overview
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