Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
ViTrox's to Exhibit at Productronica India and UGM India in September
September 19, 2022 | ViTroxEstimated reading time: 1 minute
ViTrox Technologies, aims to be the world’s most trusted technology company is pleased to announce that ViTrox is partnering with both Sales Channel Partners (SCPs), Bergen and Kyoritsu Electric India in conducting two upcoming significant events in September 2022, which are Productronica India (21st - 23rd of September) and User Group Meeting India (27th of September). ViTrox is excited to present the Industry 4.0 Full Turnkey Solution and its machine-to-machine closed-loop communication capabilities during these two events.
It's been two years since the pandemic, and ViTrox is finally back to Productronica India in-person show to showcase the latest V510i Advanced 3D Optical Inspection (AOI) Solution. This year, Productronica India will take place at India Expo Mart, Greater Noida and our booth will be located in Hall #15, Booth #PF01. You are welcome to drop a visit to our booth to further understand ViTrox’s latest and intelligent SMT PCBA solutions, our sales & technical experts will be thrilled to meet with you face-to-face.
ViTrox’s V510i Advanced 3D AOI solution enables users to perform high-speed inspections through real 3D measurements. It is equipped with A.I. Smart Programming 2.0 which reduces labor dependency and improves program quality while its Smart GUI improves programming time and is more user-friendly. Besides, V510i 3D AOI’s VVTS is enhanced with A.I. Assist which speeds up the buy-off process and improves inspection accuracy. The Comprehensive Test Coverage capability helps the users to cover more SMT component packages.
Besides that, ViTrox will be hosting our first User Group Meeting (UGM) in India on 27th September 2022 at Holiday Inn New Delhi International Airport by partnering with our two regional SCPs to highlight ViTrox's Industry 4.0 Full Turnkey SMT Inspection solutions, ranging from V310i Advanced 3D Solder Paste Inspection (API/SPI) Solution, V510i Advanced 3D Optical Inspection (AOI) Solution, V810i Advanced 3D X-Ray Inspection (AXI) Solution, V9i Advanced Robotic Vision (ARV) Solution, and Industry 4.0 Manufacturing Intelligence Solutions, V-ONE through comprehensive technology sharing sessions.
ViTrox’s UGM India serves as a great platform for our technical experts to share their technical knowledge and latest technologies with local customers. Besides, it will be a great opportunity for us to have a networking session with customers and exchange thoughts and ideas.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.