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Hon Hai Research Institute Publishes AI-Driven Silicon Carbide Technology in IEEE OJPEL

01/01/2025 | Hon Hai Technology Group
Hon Hai Technology Group announced that its Semiconductor Research Institute has successfully combined AI learning models with reinforcement learning to accelerate the research and development of silicon carbide power semiconductors.

Zhen Ding Kaohsiung AI Park Obtained the Investment Approval by the Southern Taiwan Science Park Bureau

12/30/2024 | Zhen Ding Technology
Zhen Ding Technology Holding Limited, a global leading PCB manufacturer, reported, obtained the investment application of its subsidiary in Kaohsiung Al Park approved by the Southern Taiwan Science Park Bureau.

$100M Investment Will Propel Absolics, Georgia Tech’s Advanced Packaging Research

12/30/2024 | Georgia Tech
As part of the CHIPS National Advanced Packaging Manufacturing Program (NAPMP), three advanced packaging research projects will receive investments of up to $100 million each.

6G Begins! Embarking on a New Journey of Global Interoperable Standards

12/30/2024 | JCN Newswire
On 3GPP TSG-RAN meeting, 6G RAN level study item supported by 56 co-signed companies was approved, which achieves a significant milestone of 6G standard.

'Qualcomm AI Program for Innovators' Launched to Foster On-Device AI Innovation in the Asia-Pacific Region

12/27/2024 | Qualcomm Technologies, Inc.
Qualcomm Technologies, Inc. announced the launch of the Qualcomm AI Program for Innovators (QAIPI) 2025 - APAC, a new initiative aimed at supporting professional developers and startups from Japan, Singapore, and South Korea to create cutting-edge on-device AI solutions across diverse sectors.
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