The Knowledge Base: The Era of Advanced Packaging
Standard of Excellence: Finding and Developing Future Leaders in Manufacturing
Global Sourcing Spotlight: Navigating the Variables of Holiday Schedules in Global Sourcing
Rehm Announces webinars on Soldering Processes and Networked Systems
September 21, 2022 | Rehm Thermal SystemsEstimated reading time: 2 minutes
The start of autumn also heralds the latest webinar series from Rehm Thermal Systems. In October, the in-house experts will first talk about the advantages of vapour phase soldering before moving on to the topic of connectivity with communication interfaces in SMT production. Another webinar will cover the fundamentals of reflow soldering. The final event in December will be a live webinar on the reduction of void formation in vacuum soldering. The Rehm webinars give you the opportunity to refresh your own background knowledge and gain insight into the practical application of the various Rehm systems. You can register for the webinars online at https://www.rehm-group.com/en/news/dates.html using the registration link for the relevant date.
13.10.2022 / 9.00 a.m. and 4.00 p.m. CET
Live-Webinar: Vapor phase soldering (English)
Do you process large and heavy boards for which convection soldering is out of the question? Or do you need a system with which you can reliably carry out vacuum processes at any time? Then choose a Condenso series system that can be customised to your manufacturing environment. The Condenso series system versions can be integrated into a wide range of manufacturing environments. Whether it’s a batch operation, inline connection or continuous soldering, Rehm offers the highest degree of process reliability for all areas.
The German-language webinar on this topic will take place on October 12th at 9:00 a.m. CET.
26.10.2022 / 9.00 a.m. and 4.00 p.m. CET
Live-Webinar: Connectivity – Communication interfaces in SMT production (English)
Industry 4.0 is based on intelligent, digitally networked systems that enable largely self-organized and flexible production. Standardization and smart software solutions help to achieve this. “The Hermes Standard” (IPC-HERMES-9852) ensures that important assembly information is transmitted reliably, spontaneously, simply and completely from machine to machine and to higher-level systems. With the CFX interface (IPC-CFX), communication is network-based vertical and is used for data upload and download as well as data analysis. The combination of horizontal Hermes communication and vertical CFX communication is essential for the smart factory in the long term and represents a further step towards standardization.
The German-language webinar on this topic will take place on October 25th at 9:00 a.m. CET.
01.12.2022 / 9.00 a.m. and 4.00 p.m. CET
Live-Webinar: Reduction of void formation with vacuum (English)
Vacuum soldering significantly reduces gas bubbles in solder joints and has been proven for decades in contact heat and vapour phase soldering systems. But what does this mean with regard to convection soldering, the most widely used process with the highest throughput today? In the December webinar Rehm’s experts explain the possibilities of different vacuum soldering processes and show their respective limitations.
The German-language webinar on this topic will take place on November 30th at 9:00 a.m. CET.
Participation in these webinars is free of charge.
27.10.2022 / 9.30 a.m. CET
Live-Webinar: Fundamentals of reflow soldering (English)
In the first part of our basic seminars, we provide you with the theoretical basis for reflow soldering technology. We offer interesting lectures that optimally introduce you to the basics or open up a variety of opportunities to refresh knowledge and get ideas for innovative projects. Take advantage of the opportunity to get a comprehensive overview of manufacturing processes in the electronics industry and to talk to experts from the industry. Using the latest findings from research and development, our team will prepare interesting topics for you.
The duration of this webinar is 240 min. Participation costs € 295 per person.
Share on:
Suggested Items
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5
12/23/2024 | I-Connect007 Editorial TeamChapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/13/2024 | Andy Shaughnessy, I-Connect007This week, Peter Tranitz discusses the upcoming Pan-European Electronics Design Conference, set for Jan. 29-30 in Vienna, Austria. Pete Starkey brings us a review of the most recent EIPC Technical Snapshot webinar, which featured a global PCB maker update by Dr. Hayao Nakahara. Don't miss our interview with Manfred Huschka, who explains how companies can begin their own China Plus One plan. Stan Farnsworth breaks down photonic soldering and discusses its use in soldering materials that are not typically compatible. I also enjoyed Dan Beaulieu’s discussion on the value of consistency, and why just showing up for work is half the battle, especially in an inconsistent, evolving industry like ours.
Advancing Photonic Soldering
12/11/2024 | Nolan Johnson, SMT007 MagazineStan Farnsworth, director of customer satisfaction at PulseForge, discusses the advancements in photonic soldering that highlight its energy efficiency and versatility. Over the past two years, the company has refined its applications for flexible substrates and energy reduction, finding that photonic soldering allows the processing of materials that typically aren’t thermally compatible and offers significant energy savings compared to traditional methods.
Indium Introduces New ROL0 and Halogen-free Flux-cored Wire
12/11/2024 | Indium CorporationIndium Corporation announced the global availability of CW-807RS, a new high-reliability, halide- and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.