-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
Technical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
The Path Ahead
What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
MacDermid Alpha Electronics Solutions Takes the Double at Mexico Technology Awards
September 22, 2022 | MacDermid Alpha Electronics SolutionsEstimated reading time: 2 minutes

MacDermid Alpha Electronics Solutions, global supplier of integrated solutions from our Circuitry, Assembly and Semiconductor divisions that provides unmatched capabilities in electronics design and manufacturing, is delighted to announce it has received two Mexico Technology Awards in the category of for the category Solder Paste, with ALPHA’s OM-565 HRL3 low temperature solder paste, and in the category Conformal Coatings, for Electrolube’s UVCLX UV Curable Polyurethane coating. Both awards were presented to MacDermid Alpha Electronics Solutions during a ceremony that took place during the SMTA Guadalajara Show, Sept 21-22.
Designed to mitigate warpage induced defects in temperature sensitive chip-scale packages, ALPHA OM-565 HRL3 low temperature solder paste enhances electrochemical performance over existing low melt point solders and provides excellent compatibility when used in combination with alternative ALPHA solutions for contact rework applications. The solder paste enables superior wettability to minimize post reflow defects such as Non-Wet-Open (NWO) and Head-in-Pillow (HIP). Next generation devices require a larger footprint and thinner form factor design that deliver superior processing power over existing technologies. These next generation packages create challenges for assembly at traditional SMT reflow temperatures. ALPHA OM-565 HRL3 enables a reduction in peak reflow down to 175 °C to mitigate common warpage induced defects such as HiP and NWO to improve assembly yields.
Electrolube’s UVCLX, is considered a ‘greener’ coating than many others but also delivers high-performance results. Formulated with 75% bio-organic content, UVCLX protects electronic circuitry against the harshest of environments, particularly within the automotive industry where components are at high risk from chemical attack. Applied via a selective coating machine, UVCLX exceeds traditional UV Cure Coatings by being touch dry after just a short exposure to the correct wavelength of UV light. UVCLX guarantees full cure in less than 24 hours by virtue of the secondary chemical cure mechanism, which ensures that even shadowed areas are fully cured in a matter of hours. In comparison to traditional UV Cure Coatings, that can require weeks at a time for a complete cure and still with some shadowed areas remaining uncured, UVCLX ensures a much faster work in progress.
MacDermid Alpha Electronics Solutions enables electronics interconnection through the innovative specialty chemicals and materials from our Alpha, Compugraphics, Electrolube, Kester, and MacDermid Enthone brands. We serve all global regions and all steps of device manufacturing within every segment of the electronics supply chain. The experts in our Semiconductor Solutions, Circuitry Solutions, and Assembly Solutions divisions collaborate with OEMs and fabricators in the implementation of new technologies that redefine what is possible in device design. Our world class technical service is constantly at hand to ensure optimized outcomes in yield and productivity. Our solutions can increase throughput, reduce carbon footprints, lower total cost of ownership, and enable electronics innovation.
Suggested Items
AIM Solder Partners with Performance Technologies Group for Sales Representation in Northeast US
03/12/2025 | AIM SolderAIM Solder, a global leader in solder assembly materials for the electronics industry, is excited to announce its new partnership with Performance Technologies Group, Inc. (PTG), an established electronic manufacturers’ representative.
Indium Corporation, Industry Partners to Showcase Products 'Live@APEX'
03/10/2025 | Indium CorporationIndium Corporation®, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from March 18-20 in Anaheim, California.
Indium Experts to Present on Solder and Thermal Solutions at APEX 2025
03/07/2025 | Indium CorporationAs a global supplier of solder and thermal interface material (TIM) products, Indium Corporation experts are proud to share their technical insight and knowledge on a variety of industry-related topics at IPC APEX Expo, March 18-20 in Anaheim, California.
Indium to Showcase High-Reliability Solder Technology at IPC APEX EXPO 2025
03/05/2025 | Indium CorporationIndium Corporation®, a leading materials provider for the electronics assembly market, will feature its high-reliability solder solutions at IPC APEX EXPO 2025, taking place March 18-20 in Anaheim, California.
Black Diamond Orders Hentec Industries/RPS Automation Vector 300 with EMP Upgrade
03/03/2025 | Hentec Industries/RPS AutomationThe Vector 300 is the most compact model in the selective soldering Vector series lineup, making it ideal for facilities with limited space. Despite its size, the Vector 300 can process boards up to 300 x 300 mm (11.8 x 11.8 in.).