Marcy’s Musings: Thank You, Columnists!
It’s Only Common Sense: Stop Pretending Your Customers Are Loyal
Happy’s Tech Talk #44: Memories of the ‘Mystery Systems of the East’
DuPont Pyralux AP to Aid Reliable Performance of Semikron-Danfoss eMPack Modules Powering Next-Gen EV
September 22, 2022 | DuPontEstimated reading time: 1 minute
DuPont Interconnect Solutions, part of the Electronics & Industrial business, announced a multiyear contract with European power module manufacturer Semikron-Danfoss who will integrate DuPont™ Pyralux® AP all-polyimide double-sided copper clad laminate into its eMPack® power modules to further enhance the capabilities of next-gen electric vehicles.
Integrating Pyralux® AP copper clad laminate into eMPack® traction inverter designs will help EV automotive engineers address key requirements related to signal integrity and power transmission. The characteristics of Pyralux® AP benefiting this application from Semikron-Danfoss include:
- Robust thermal resistance for temperature stability
- All-polyimide dielectric layer
- Extreme durability
- Excellent bond strength for automotive-grade reliability
- Excellent low dissipation loss characteristics
- Superior electrical performance
- Consistent signal integrity
Further, Pyralux® AP’s dielectric thickness tolerance and low coefficient of thermal expansion make it ideal for rigid flex or multiple layer flex applications. The adhesive-less flexible circuit material has a flammability rating of UL 94-V0, a maximum operating temperature of 200°C, and is certified to IPC 4204A/11.
"Pyralux® AP emerged as our best-fit solution after extensive testing and because the product has demonstrated three decades of stable, reliable performance in a variety of industries where operating conditions, like ours, are severe,” said Karl-Heinz Gaubatz, CTO of Semikron. “eMPack® is a perfect fit to SiC MOSFET power modules. We look forward to working with DuPont and their Pyralux® technology to help eMPack® become a global leader in EV power modules.”
Earlier this year, Semikron-Danfoss, headquartered in Nuremburg, Germany, won a billion-Euro contract beginning in 2025 to furnish patented eMPack® power modules to a major German automotive manufacturer. Within silicon-carbide MOSFET or full silicon-carbide technology-based modules, traction inverters can be created which are extremely compact, scalable, and reliable because of a Semikron double side sintered assembly and connection technology called Direct Pressed Die (DPD).
“We are excited how this EV power module application of Pyralux® AP copper clad laminate supports a sustainable and electrified future to help preserve our planet for generations to come,” said Andy Kannurpatti, Global Business Director, Films & Laminates, DuPont Interconnect Solutions. “The eMPack® power module is expected to enable millions of next-gen electric vehicles by 2032. We look forward to contributing significantly to the much-anticipated success of eMPack® and appreciate the collaboration with Semikron-Danfoss.”
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
The Impact of the AI Boom on PCB and Raw Materials Supply Chains
11/13/2025 | Mark Goodwin, Ventec International GroupThe PCB industry is entering a period of unprecedented structural change, driven by the demands of artificial intelligence and advanced computing. What was once a cyclical market has become a capacity race. It’s one that rewards foresight, collaboration, and strategic supply partnerships. Understanding these dynamics is essential for maintaining stability and growth across all market segments. This report, created by Ventec International Group, provides a clear view of how AI-driven demand is reshaping the PCB materials landscape and what actions are required to secure long-term supply.
Elementary, Mr. Watson: The Four Horsemen of Copper Confusion
11/12/2025 | John Watson -- Column: Elementary, Mr. WatsonIf there were a PCB Design Dictionary of Confusing Terms, the cover would feature four words that have baffled generations of engineers: polygons, pours, planes, and floods—or what I refer to as the four horsemen of copper confusion. They sound simple, as if they belong in a geometry textbook or a weather report, but in PCB design, they overlap, develop, and sound interchangeable until you realize they aren't.
Alpha Insights, Performance by Design: Understanding Heat at the Core of Every Design
11/11/2025 | Team Alpha -- Column: Alpha Insights: Performance by DesignPower isn’t just about current. It’s about control. As electronic systems grow smaller and faster, every amp and every layer generates a new source of heat. That heat is more than a byproduct. It’s a measure of efficiency, a benchmark of performance, and often the first indication of failure.
The Shaughnessy Report: Zee Plane! Zee Plane!
11/11/2025 | Andy Shaughnessy -- Column: The Shaughnessy ReportPlanes aren’t magic, but they are big time-savers. Without planes, designers would have to create thousands of traces to accomplish the same objectives. You can imagine the first time a designer thought about using a sheet of copper, asking, “Hey, why am I killing myself laying out all these traces? Can’t I just use this sheet of copper instead?”
November 2025 Design007 Magazine: Proper Plane Design
11/10/2025 | I-Connect007 Editorial TeamWithout planes, designers would have to create thousands of traces to accomplish the same objectives. Power planes provide low impedance and stable power to every component on the board, much like a large power bus. Ground planes stabilize reference voltage, improve thermal performance, and help preclude EMI issues. Power and ground plane design is often a battle of tradeoffs.