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KYZEN Wins 2022 Mexico Technology Award for New Next-Generation Aqueous Cleaning Solution
September 23, 2022 | KYZEN'Estimated reading time: 1 minute

KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, is pleased to announce that it received a 2022 Mexico Technology Award in the category of Cleaning Materials for its AQUANOX A4626 Next Generation Aqueous Cleaning Solution. The award was announced during a ceremony that took place Wednesday, Sept. 21, 2022 during SMTA Guadalajara in Mexico.
AQUANOX A4626 is a next generation cleaning chemistry designed to remove the latest polymeric no-clean flux residues effectively and efficiently while providing superior results on traditional lead-free and eutectic tin-lead residues as well. It has a long tank life and is safe for multi-pass applications.
KYZEN products and cleaning experts have always been focused on the process so you can be sure the newest AQUANOX product will fit into your production line. Adding KYZEN's Process Control System or the KYZEN Analystwill complete the optimization and provide you with a worry-free process.
KYZEN’s Executive Vice President Tom Forsythe says, “Once again hundreds, if not thousands of hours in the lab as well as being field tested has proven that continuous improvement is still alive and well at KYZEN. AQUANOX A4626 is an innovative and eco-friendly aqueous product that will be a force in electronics cleaning applications around the world.”
The Mexico Technology Awards acknowledge the latest innovations available in Mexico produced by OEM manufacturing equipment and materials suppliers during the last 12 months.
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Summit Interconnect Announces Appointment of Leo LaCroix as Chief Operating Officer
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Leadership Change at Koh Young Europe
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TTM Technologies, Inc. Announces Retirement Plans of its CEO and Proceeds with CEO Successor Search
08/04/2025 | TTM Technologies, Inc.TTM Technologies, Inc., a leading global manufacturer of technology solutions including mission systems, radio frequency (“RF”) components and RF microwave/microelectronic assemblies, quick-turn and technologically advanced printed circuit boards (“PCB”), today announced that Thomas T. Edman, the company’s President and Chief Executive Officer, intends to retire following the appointment of the company’s next President and CEO.
Advancing Electrolytic Copper Plating for AI-driven Package Substrates
08/05/2025 | Dirk Ruess and Mustafa Oezkoek, MKS’ AtotechThe rise of artificial intelligence (AI) applications has become a pivotal force driving growth in the server industry. Its challenging requirements for high-frequency and high-density computing are leading to an increasing demand for development of advanced manufacturing methods of package substrates with finer features, higher hole densities, and denser interconnects. These requirements are essential for modern multilayer board (MLB) designs, which play a critical role in AI hardware. However, these intricate designs introduce considerable manufacturing complexities.