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Current IssueDo You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
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Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
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October 2022 Issue of SMT007 Magazine Available Now
October 3, 2022 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute

One of the best places to get back into the swing of trade shows is SMTA International (SMTAI), taking place Oct. 31–Nov. 4, in Minneapolis, Minnesota, USA. The event is co-located with the four other shows that comprise the MD&M show.
Besides providing an expo floor showcasing what’s new in the market, SMTAI also delivers one of the strongest technical conferences in the electronics manufacturing space. In response, we’re devoting this issue of SMT007 Magazine to pre-show coverage of SMTA International. One of our goals with this issue is to give attendees and exhibitors a detailed guide to this event. In addition, if you, or perhaps your supervisor, need some convincing as to why you should attend SMTAI this year, then this issue will help you make your case.
Don't miss this issue of SMT007 Magazine. Download your copy today on the virtual newsstand or sign up for delivery in your e-mailbox by subscribing here.
Suggested Items
IPC APEX EXPO 2025 Review: Expecting the Unexpected
03/31/2025 | Tom Kastner, GP VenturesOne of the best things about trade shows is not the scheduled meetings but the chance meetings that come up unexpectedly. Just because you happened to go down one aisle instead of the next, you bump into an old acquaintance that you have not seen for years, or you happen to talk to the guy in line next to you to get a $5 Pepsi, and it turns into a great, new connection.
Target Condition: ‘Boomer to Zoomer: Do You Copy?’
03/04/2025 | Kelly Dack -- Column: Target ConditionLet’s just admit it. The baby boomer PCB designers are looking at retirement, but it’s been a good run. In the 1980s, many of us still “taped out” our PCB artwork layers and then drove them over to the graphic art service to be photo-reduced onto film positives and negatives. Then, almost overnight, the PCB design industry changed.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
02/21/2025 | Nolan Johnson, I-Connect007When I first started covering trade shows for I-Connect007 about six years ago, my calendar would see me attending shows 13 of the 23 weeks over the winter. Much has changed since the pandemic, and I bring this up because my picks for the week reflect on that. Which makes sense, because we’re already launched into a new and important trade show season. From Brittany Martin’s invaluable tips for making the most of your marketing efforts, to SMTA’s new scholarship, there’s a lot of information to be had. I hope you read it the first time around, but if not, it’s worth checking out. Share it with your colleagues. Let’s get this news out there.
The Marketing Minute: Trade Shows—The Investment That Keeps on Giving
02/19/2025 | Brittany Martin -- Column: The Marketing MinuteThink trade shows are only about shaking hands, swapping electronic business cards, and collecting an alarming number of free pens? Think again. In the electronics industry, trade shows are marketing goldmines that can supercharge your brand—before, during, and long after the event ends. It’s more than just showing up; it’s about showing off (strategically, of course).
Overview of Soldering Systems With Vacuum
12/18/2024 | Dr. Paul Wild, Rehm Thermal Systems GmbHWhen soldering electronic assemblies, the focus of the vacuum application is on the removal of volatile substances from the solder joints and the associated reduction of pore formation. Particularly in the thermal management of power electronics components, pores can cause so-called hotspots with higher temperatures due to their poor heat conduction. These hotspots can lead to overheating of the components on the one hand and to thermally induced destruction of the solder structure on the other.